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Contents

README

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RSJ250P10TL

ROHM Semicon · MOSFETs · TO-263

RSJ250P10TL from ROHM Semicon, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal with an ESD protection diode to source; VGSS is limited to ±20V and VGS(th) is -1.0 to -2.5V at ID = -1mA.
2 Drain passive Drain terminal (tab) of the P-channel MOSFET, with VDSS of -100V and continuous drain current ID of ±25A.
3 Source passive Source terminal, connected to the body diode, with continuous forward current IS of -25A.

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package TO-263
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain - Source breakdown voltage V(BR)DSS -100 V VGS = 0V, ID = -1mA 2
Zero gate voltage drain current IDSS -1 μA VDS = -100V, VGS = 0V 2
Gate - Source leakage current IGSS -10 10 μA VGS = ±20V, VDS = 0V 2
Gate threshold voltage VGS(th) -1 -2.5 V VDS = -10V, ID = -1mA 2
Static drain - source on-state resistance RDS(on) 45 63 mΩ VGS = -10V, ID = -25A (pulsed) 2
Static drain - source on-state resistance RDS(on) 48 67 mΩ VGS = -4.5V, ID = -12.5A (pulsed) 2
Static drain - source on-state resistance RDS(on) 50 70 mΩ VGS = -4.0V, ID = -12.5A (pulsed) 2
Forward transfer admittance /Yfs/ 20 S VDS = -10V, ID = -25A (pulsed) 2
Continuous forward current (body diode) IS -25 A Ta = 25℃ 3
Pulse forward current (body diode) ISP -50 A Pw ≤ 10μs, Duty cycle ≤ 1% 3
Forward voltage (body diode) VSD -1.2 V VGS = 0V, IS = -25A (pulsed) 3
Drain - Source voltage VDSS -100 V 1
Continuous drain current ID -25 25 A Tc = 25°C, limited only by maximum temperature allowed (note *1) 1
Pulsed drain current IDP -50 50 A Pw ≤ 10μs, Duty cycle ≤ 1% (note *2) 1
Gate - Source voltage VGSS -20 20 V 1
Power dissipation PD 50 W Tc = 25°C, limited only by maximum temperature allowed (note *1) 1
Junction temperature Tj 150 ℃ 1
Operating junction and storage temperature range Tstg -55 150 ℃ 1
Thermal resistance, junction - case RthJC 2.5 ℃/W note *1: Tc = 25℃, limited only by maximum temperature allowed 2

CAD (KiCad official)

  • Symbol: RSJ250P10TL
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: rsj250p10tl-etched.step / rsj250p10tl-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rsj250p10tl.step / rsj250p10tl.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (14 pp, sha256 2dea958c701a9f76, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF