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Contents

README

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RS85N150S

REASUNOS · MOSFETs · TO-263

RS85N150S from REASUNOS, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with VGS limited to ±20 V and a threshold of 2.0 to 4.0 V at ID=250µA.
2 D passive Drain, connected to the exposed tab; the middle lead is trimmed or shortened in the drawing. Rated for VDSS 85 V and continuous ID 150 A at TC=25℃.
3 S passive Source; connects to the body diode anode, with continuous source current up to 150 A.

Key specifications

Parameter Value
Manufacturer REASUNOS
Package TO-263
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDSS 85 V Tc=25℃ unless otherwise specified 1
Continuous Drain Current ID 150 A TC=25℃ 1
Continuous Drain Current ID 140 A TC=100℃ 1
Pulsed Drain Current IDM 600 A 1
Power Dissipation PD 312 W 1
Gate-to-Source Voltage VGS -20 20 V 1
Single Pulse Avalanche Energy EAS 756 mJ L = 0.5mH,IS = 55A, RG = 25Ω, Tj = 25℃ 1
Maximum Temperature for Soldering, leads TL 300 ℃ Leads at 0.063in(1.6mm) from case for 10 seconds 1
Maximum Temperature for Soldering, package body TPKG 260 ℃ Package body for 10 seconds 1
Operating Junction and Storage Temperature Range TJ and TSTG -55 150 ℃ 1
Drain-to-Source Breakdown Voltage BVDSS 85 V VGS=0V, ID=250µA 2
Drain-to-Source Leakage Current IDSS 1 µA VDS=80V, VGS=0V 2
Gate-to-Source Forward Leakage Current IGSS 100 nA VGS=20V, VDS=0V 2
Gate-to-Source Reverse Leakage Current IGSS -100 nA VGS=-20V, VDS=0V 2
Static Drain-to-Source On-Resistance RDS(on) 2.7 3.4 mΩ VGS=10V, ID=60A 2
Gate Threshold Voltage VGS(TH) 2 4 V VGS=VDS, ID=250µA 2
Junction-to-Case Thermal Resistance RθJC 0.4 ℃/W Drain lead soldered to water cooled heatsink, PD adjusted for a peak junction temperature of +150℃ 2
Junction-to-Ambient Thermal Resistance RθJA 52 ℃/W 1 cubic foot chamber, free air 2
Continuous Source Current (integral pn-diode) IS 150 A Integral pn-diode in MOSFET 3
Maximum Pulsed Current ISM 600 A 3
Diode Forward Voltage VSD 1.4 V IS=60A, VGS=0V 3

CAD (KiCad official)

  • Symbol: RS85N150S
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: rs85n150s-etched.step / rs85n150s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs85n150s.step / rs85n150s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: REASUNOS datasheet (9 pp, sha256 68c7de8dc56e213a, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF