component
RS85N140T
Public Made by Adomby adom
REASUNOS MOSFETs, TO-220. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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RS85N140T
REASUNOS · MOSFETs · TO-220
RS85N140T from REASUNOS, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with gate-to-source voltage limited to ±20 V and threshold of 2.1 to 4.1 V at ID=250 µA. |
| 2 | D | passive | Drain (also connected to the mounting tab); 85 V VDSS, 140 A continuous at TC=25℃ and 490 A pulsed. |
| 3 | S | passive | Source; carries up to 140 A continuous through the integral body diode, and RDS(on) is 4.5 mΩ typ (5.3 mΩ max) at VGS=10 V, ID=50 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | REASUNOS |
| Package | TO-220 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | BVDSS | 85 | V | VGS=0V,ID=250µA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 1 | µA | VDS=80V,VGS=0V | 2 | ||
| Gate-to-Source Forward Leakage | IGSS | 100 | nA | VGS=20V ,VDS=0V | 2 | ||
| Gate-to-Source Reverse Leakage | IGSS | -100 | nA | VGS=-20V ,VDS=0V | 2 | ||
| Static Drain-to-Source On-Resistance | RDS(on) | 4.5 | 5.3 | mΩ | VGS=10V,ID=50A | 2 | |
| Gate Threshold Voltage | VGS(TH) | 2.1 | 4.1 | V | VGS=VDS,ID=250µA | 2 | |
| Continuous Source Current | IS | 140 | A | Integral pn-diode in MOSFET | 3 | ||
| Maximum Pulsed Current | ISM | 490 | A | Integral pn-diode in MOSFET | 3 | ||
| Diode Forward Voltage | VSD | 1.4 | V | IS=50A,VGS=0V | 3 | ||
| Drain-to-Source Voltage | VDSS | 85 | V | Tc=25℃ | 1 | ||
| Continuous Drain Current | ID | 140 | A | TC=25℃ | 1 | ||
| Continuous Drain Current | ID | 125 | A | TC=100℃ | 1 | ||
| Pulsed Drain Current | IDM | 490 | A | 1 | |||
| Power Dissipation | PD | 174 | W | 1 | |||
| Gate-to-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Single Pulse Avalanche Energy | EAS | 150 | mJ | L = 0.5mH,VDD = 50V, RG = 25Ω, Tj = 25℃ | 1 | ||
| Maximum Soldering Temperature, Leads | TL | 300 | ℃ | Leads at 0.063in(1.6mm) from Case for 10 seconds | 1 | ||
| Maximum Soldering Temperature, Package Body | TPKG | 260 | ℃ | Package Body for 10 seconds | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, TSTG | -55 | 150 | ℃ | 1 | ||
| Junction-to-Case Thermal Resistance | RθJC | 0.7 | ℃/W | Drain lead soldered to water cooled heatsink, PD adjusted for a peak junction temperature of +150℃ | 2 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 62 | ℃/W | 1 cubic foot chamber,free air | 2 | ||
| Turn-on Delay Time | td(ON) | 20 | nS | VDS=40V, RG=3Ω, VGS=10V | 2 | ||
| Rise Time | trise | 38.7 | nS | VDS=40V, RG=3Ω, VGS=10V | 2 | ||
| Turn-off Delay Time | td(OFF) | 46 | nS | VDS=40V, RG=3Ω, VGS=10V | 2 | ||
| Fall Time | tfall | 23 | nS | VDS=40V, RG=3Ω, VGS=10V | 2 | ||
| Input Capacitance | Ciss | 3090 | pF | VGS=0V, VDS=40V, f=1MHz | 3 | ||
| Output Capacitance | Coss | 30 | pF | VGS=0V, VDS=40V, f=1MHz | 3 | ||
| Reverse Transfer Capacitance | Crss | 55 | pF | VGS=0V, VDS=40V, f=1MHz | 3 | ||
| Total Gate Charge | Qg | 55 | nC | VDS=50V, ID=40A, VGS=10V | 3 | ||
| Gate-to-Source Charge | Qgs | 15 | nC | VDS=50V, ID=40A, VGS=10V | 3 | ||
| Gate-to-Drain (Miller) Charge | Qgd | 12 | nC | VDS=50V, ID=40A, VGS=10V | 3 | ||
| Reverse Recovery Time | trr | 60 | nS | VGS=0V, IS=20A, di/dt=100A/µs | 3 | ||
| Reverse Recovery Charge | Qrr | 565 | nC | VGS=0V, IS=20A, di/dt=100A/µs | 3 |
CAD (KiCad official)
- Symbol:
RS85N140T - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files:
rs85n140t-etched.step/rs85n140t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs85n140t.step/rs85n140t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: REASUNOS datasheet (9 pp, sha256
f7476f8d38b9cbf4, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RS85N140T
**REASUNOS** · MOSFETs · TO-220
RS85N140T from REASUNOS, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with gate-to-source voltage limited to ±20 V and threshold of 2.1 to 4.1 V at ID=250 µA. |
| 2 | D | passive | Drain (also connected to the mounting tab); 85 V VDSS, 140 A continuous at TC=25℃ and 490 A pulsed. |
| 3 | S | passive | Source; carries up to 140 A continuous through the integral body diode, and RDS(on) is 4.5 mΩ typ (5.3 mΩ max) at VGS=10 V, ID=50 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | REASUNOS |
| Package | TO-220 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | BVDSS | 85 | | | V | VGS=0V,ID=250µA | 2 |
| Drain-to-Source Leakage Current | IDSS | | | 1 | µA | VDS=80V,VGS=0V | 2 |
| Gate-to-Source Forward Leakage | IGSS | | | 100 | nA | VGS=20V ,VDS=0V | 2 |
| Gate-to-Source Reverse Leakage | IGSS | -100 | | | nA | VGS=-20V ,VDS=0V | 2 |
| Static Drain-to-Source On-Resistance | RDS(on) | | 4.5 | 5.3 | mΩ | VGS=10V,ID=50A | 2 |
| Gate Threshold Voltage | VGS(TH) | 2.1 | | 4.1 | V | VGS=VDS,ID=250µA | 2 |
| Continuous Source Current | IS | | | 140 | A | Integral pn-diode in MOSFET | 3 |
| Maximum Pulsed Current | ISM | | | 490 | A | Integral pn-diode in MOSFET | 3 |
| Diode Forward Voltage | VSD | | | 1.4 | V | IS=50A,VGS=0V | 3 |
| Drain-to-Source Voltage | VDSS | | | 85 | V | Tc=25℃ | 1 |
| Continuous Drain Current | ID | | | 140 | A | TC=25℃ | 1 |
| Continuous Drain Current | ID | | | 125 | A | TC=100℃ | 1 |
| Pulsed Drain Current | IDM | | | 490 | A | | 1 |
| Power Dissipation | PD | | | 174 | W | | 1 |
| Gate-to-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Single Pulse Avalanche Energy | EAS | | | 150 | mJ | L = 0.5mH,VDD = 50V, RG = 25Ω, Tj = 25℃ | 1 |
| Maximum Soldering Temperature, Leads | TL | | | 300 | ℃ | Leads at 0.063in(1.6mm) from Case for 10 seconds | 1 |
| Maximum Soldering Temperature, Package Body | TPKG | | | 260 | ℃ | Package Body for 10 seconds | 1 |
| Operating Junction and Storage Temperature Range | TJ, TSTG | -55 | | 150 | ℃ | | 1 |
| Junction-to-Case Thermal Resistance | RθJC | | | 0.7 | ℃/W | Drain lead soldered to water cooled heatsink, PD adjusted for a peak junction temperature of +150℃ | 2 |
| Junction-to-Ambient Thermal Resistance | RθJA | | | 62 | ℃/W | 1 cubic foot chamber,free air | 2 |
| Turn-on Delay Time | td(ON) | | 20 | | nS | VDS=40V, RG=3Ω, VGS=10V | 2 |
| Rise Time | trise | | 38.7 | | nS | VDS=40V, RG=3Ω, VGS=10V | 2 |
| Turn-off Delay Time | td(OFF) | | 46 | | nS | VDS=40V, RG=3Ω, VGS=10V | 2 |
| Fall Time | tfall | | 23 | | nS | VDS=40V, RG=3Ω, VGS=10V | 2 |
| Input Capacitance | Ciss | | 3090 | | pF | VGS=0V, VDS=40V, f=1MHz | 3 |
| Output Capacitance | Coss | | 30 | | pF | VGS=0V, VDS=40V, f=1MHz | 3 |
| Reverse Transfer Capacitance | Crss | | 55 | | pF | VGS=0V, VDS=40V, f=1MHz | 3 |
| Total Gate Charge | Qg | | 55 | | nC | VDS=50V, ID=40A, VGS=10V | 3 |
| Gate-to-Source Charge | Qgs | | 15 | | nC | VDS=50V, ID=40A, VGS=10V | 3 |
| Gate-to-Drain (Miller) Charge | Qgd | | 12 | | nC | VDS=50V, ID=40A, VGS=10V | 3 |
| Reverse Recovery Time | trr | | 60 | | nS | VGS=0V, IS=20A, di/dt=100A/µs | 3 |
| Reverse Recovery Charge | Qrr | | 565 | | nC | VGS=0V, IS=20A, di/dt=100A/µs | 3 |
## CAD (KiCad official)
- Symbol: `RS85N140T`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files: `rs85n140t-etched.step` / `rs85n140t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rs85n140t.step` / `rs85n140t.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [REASUNOS datasheet](docs/rs85n140t-datasheet.pdf) (9 pp, sha256 `f7476f8d38b9cbf4`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rs85n140t-datasheet.pdf)