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Ray Publish 0.1.0 4de1b71 7d ago

RS6G120BGTB1

ROHM Semicon · MOSFETs · HSOP-8

RS6G120BGTB1 from ROHM Semicon, in a HSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Source passive Source terminal of the Nch MOSFET, tied internally to pins 2 and 3.
2 Source passive Source terminal of the Nch MOSFET, tied internally to pins 1 and 3.
3 Source passive Source terminal of the Nch MOSFET, tied internally to pins 1 and 2.
4 Gate input Gate terminal with a maximum gate-source voltage of ±20V and a threshold of 1.0 to 2.5V.
5 Drain passive Drain terminal (40V VDSS), tied internally to pins 6, 7 and 8.
6 Drain passive Drain terminal (40V VDSS), tied internally to pins 5, 7 and 8.
7 Drain passive Drain terminal (40V VDSS), tied internally to pins 5, 6 and 8.
8 Drain passive Drain terminal (40V VDSS), tied internally to pins 5, 6 and 7.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer ROHM Semicon
Package HSOP-8
Category Triode/MOS Tube/Transistor
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain - Source voltage VDSS 40 V 1
Continuous drain current (silicon limit) ID -210 210 A Silicon limit (VGS=10V) 1
Continuous drain current ID -120 120 A Tc = 25°C (VGS=10V) 1
Pulsed drain current IDP -840 840 A *3 Pw ≤ 10μs, Duty cycle ≤ 1% 1
Gate - Source voltage VGSS -20 20 V 1
Avalanche current, single pulse IAS 50 A *4 L ⋍ 0.1mH, VDD = 20V, RG = 25Ω, Starting Tj = 25℃ Fig.3-1,3-2 1
Avalanche energy, single pulse EAS 187 mJ *4 L ⋍ 0.1mH, VDD = 20V, RG = 25Ω, Starting Tj = 25℃ Fig.3-1,3-2 1
Power dissipation PD 104 W *2 Tc=25℃ 1
Power dissipation PD 3 W *5 Mounted on a Cu board (40×40×0.8mm) 1
Junction temperature Tj 150 ℃ 1
Operating junction and storage temperature range Tstg -55 150 ℃ 1
Thermal resistance, junction - case RthJC 1.2 ℃/W *2 Tc=25℃, Limited only by maximum temperature allowed 2
Thermal resistance, junction - ambient RthJA 41.7 ℃/W *5 Mounted on a Cu board (40×40×0.8mm) 2
Drain - Source breakdown voltage V(BR)DSS 40 V VGS = 0V, ID = 1mA 2
Zero gate voltage drain current IDSS 2 μA VDS = 40V, VGS = 0V 2
Gate - Source leakage current IGSS -200 200 nA VGS = ±20V, VDS = 0V 2
Gate threshold voltage VGS(th) 1 2.5 V VDS = VGS, ID = 1mA 2
Static drain - source on - state resistance RDS(on) 1.03 1.34 mΩ VGS = 10V, ID = 90A 2
Static drain - source on - state resistance RDS(on) 1.74 2.43 mΩ VGS = 4.5V, ID = 60A 2
Forward Transfer Admittance /Yfs/ 50 S VDS = 5V, ID = 60A 2
Continuous forward current IS 85 A Ta = 25℃ 3
Pulse forward current ISP 840 A *3 Pw ≤ 10μs, Duty cycle ≤ 1% 3
Forward voltage VSD 1.2 V VGS = 0V, IS = 85A 3

CAD (KiCad official)

  • Symbol: RS6G120BGTB1
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm
  • 3D model: HSOP-8 (KiCad packages3D, STEP)
  • 3D model files: rs6g120bgtb1-etched.step / rs6g120bgtb1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs6g120bgtb1.step / rs6g120bgtb1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ROHM Semicon datasheet (13 pp, sha256 d59a5b8f22ee8162, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF