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RS4G00XP

Jiangsu RUNIC Tech · Gates · SOIC-14

RS4G00XP from Jiangsu RUNIC Tech, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Channel 1 logic input; unused inputs must be held at VCC or GND, accepts voltage up to 5.5V.
2 1B input Channel 1 logic input; unused inputs must be held at VCC or GND, accepts voltage up to 5.5V.
3 1Y output Channel 1 logic level output (NAND of 1A and 1B), drives ±24mA at VCC=3.0V.
4 2A input Channel 2 logic input; unused inputs must be held at VCC or GND, accepts voltage up to 5.5V.
5 2B input Channel 2 logic input; unused inputs must be held at VCC or GND, accepts voltage up to 5.5V.
6 2Y output Channel 2 logic level output (NAND of 2A and 2B), drives ±24mA at VCC=3.0V.
7 GND power_in Ground.
8 3Y output Channel 3 logic level output (NAND of 3A and 3B), drives ±24mA at VCC=3.0V.
9 3A input Channel 3 logic input; unused inputs must be held at VCC or GND, accepts voltage up to 5.5V.
10 3B input Channel 3 logic input; unused inputs must be held at VCC or GND, accepts voltage up to 5.5V.
11 4Y output Channel 4 logic level output (NAND of 4A and 4B), drives ±24mA at VCC=3.0V.
12 4A input Channel 4 logic input; unused inputs must be held at VCC or GND, accepts voltage up to 5.5V.
13 4B input Channel 4 logic input; unused inputs must be held at VCC or GND, accepts voltage up to 5.5V.
14 VCC power_in Power supply, operating range 1.65V to 5.5V (absolute maximum 6.5V).

Key specifications

Parameter Value
Manufacturer Jiangsu RUNIC Tech
Package SOIC-14
Category Logic ICs
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, operating VCC 1.65 5.5 V Operating 6
Supply voltage, data retention VCC 1.5 5.5 V Data retention only 6
High-level input voltage VIH 1.7 V VCC=2.3V to 2.7V 6
High-level input voltage VIH 2.2 V VCC=3V to 3.6V 6
Low-level input voltage VIL 0.3 V VCC=2.3V to 2.7V 6
Low-level input voltage VIL 0.4 V VCC=3V to 3.6V 6
Input voltage VI 0 5.5 V 6
Input transition rise or fall tr, tf 20 ns/V VCC=1.8V± 0.15V,2.5V ± 0.2V 6
Input transition rise or fall tr, tf 10 ns/V VCC=3.3V± 0.3V 6
Input transition rise or fall tr, tf 5 ns/V VCC=5V± 0.5V 6
Operating temperature TA -40 125 °C 6
Supply voltage range VCC -0.5 6.5 V 4
Input voltage range VI -0.5 6.5 V 4
Output voltage range, high-impedance or power-off state Vo -0.5 6.5 V high-impedance or power-off state 4
Input clamp current IIK -50 mA VI<0 4
Output clamp current IOK -50 mA VO<0 4
Continuous output current IO -50 50 mA 4
Continuous current through VCC or GND -100 100 mA 4
Junction temperature TJ -65 150 °C 4
Storage temperature Tstg -65 150 °C 4
ESD human-body model V(ESD) -8000 8000 V HBM 4
ESD machine model V(ESD) -500 500 V MM 4
Junction-to-ambient thermal resistance RϴJA 122.2 °C/W SOIC-14(SOP14) 4
Junction-to-case(top) thermal resistance RϴJC(top) 80.9 °C/W SOIC-14(SOP14) 4
Junction-to-board thermal resistance RϴJB 80.6 °C/W SOIC-14(SOP14) 4
Junction-to-top characterization parameter ѰJT 40.4 °C/W SOIC-14(SOP14) 4
Junction-to-board characterization parameter ѰJB 80.3 °C/W SOIC-14(SOP14) 4
High-level output voltage VOH 1.2 V IOH = -4mA, VCC=1.65V, Full 7
High-level output voltage VOH 1.9 V IOH = -8mA, VCC=2.3V, Full 7
High-level output voltage VOH 2.4 V IOH = -16mA, VCC=3V, Full 7
High-level output voltage VOH 2.3 V IOH = -24mA, VCC=3V, Full 7
High-level output voltage VOH 3.8 V IOH = -32mA, VCC=4.5V, Full 7
Low-level output voltage VOL 0.1 V IOL = 100μA, VCC=1.65V to 5.5V, Full 7
Low-level output voltage VOL 0.45 V IOL = 4mA, VCC=1.65V, Full 7
Low-level output voltage VOL 0.3 V IOL = 8mA, VCC=2.3V, Full 7
Low-level output voltage VOL 0.4 V IOL = 16mA, VCC=3V, Full 7
Low-level output voltage VOL 0.55 V IOL = 24mA, VCC=3V, Full 7
Input current, A or B inputs II -1 0.1 1 µA VI=5.5V or GND, VCC=0V to 5.5V, +25C 7
Input current, A or B inputs II -5 5 µA VI=5.5V or GND, VCC=0V to 5.5V, Full 7
Power-off leakage current Ioff -1 0.1 1 µA VI or VO=5.5V, VCC=0, +25C 7
Power-off leakage current Ioff -10 10 µA VI or VO=5.5V, VCC=0, Full 7
Supply current ICC 0.1 4 µA VI=5.5V or GND, IO=0, VCC=1.65V to 5.5V, +25C 7
Supply current ICC 10 µA VI=5.5V or GND, IO=0, VCC=1.65V to 5.5V, Full 7
Additional supply current per input ΔICC 500 µA One input at VCC-0.6V, other inputs at VCC or GND, VCC=3V to 5.5V, Full 7
Propagation delay tpd 21 ns VCC=1.8V±0.15V, CL=30pF, RL=500Ω, Full 7
Propagation delay tpd 7.8 ns VCC=2.5V±0.2V, CL=30pF, RL=500Ω, Full 7
Propagation delay tpd 5.7 ns VCC=3.3V±0.3V, CL=50pF, RL=500Ω, Full 7
Propagation delay tpd 4.2 ns VCC=5V±0.5V, CL=50pF, RL=500Ω, Full 7
Input capacitance Ci 4 pF VCC=3.3V, VI=VCC or GND, +25C 7
Power dissipation capacitance Cpd 21 pF VCC=1.8V, f=10MHz, +25C 7
Power dissipation capacitance Cpd 22 pF VCC=2.5V, f=10MHz, +25C 7
Power dissipation capacitance Cpd 25 pF VCC=5V, f=10MHz, +25C 7

CAD (KiCad official)

  • Symbol: RS4G00XP
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: rs4g00xp-etched.step / rs4g00xp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs4g00xp.step / rs4g00xp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jiangsu RUNIC Tech datasheet (11 pp, sha256 eccdbf8f5e0ae780, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF