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RS3MFSH

Taiwan Semiconductor · Fast Recovery / High Efficiency Diodes · SOD-128

RS3MFSH from Taiwan Semiconductor, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor
Package SOD-128
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage VF 1.1 1.21 V IF = 1.5A, TJ = 25°C 2
Forward voltage VF 1.2 1.3 V IF = 3.0A, TJ = 25°C 2
Forward voltage VF 0.9 1 V IF = 1.5A, TJ = 125°C 2
Forward voltage VF 1.03 1.2 V IF = 3.0A, TJ = 125°C 2
Reverse current IR 5 μA @ rated VR, TJ = 25°C; pulse test PW = 30ms 2
Reverse current IR 250 μA @ rated VR, TJ = 150°C; pulse test PW = 30ms 2
Junction capacitance CJ 15 pF 1MHz, VR = 4.0V 2
Reverse recovery time trr 160 ns IF = 0.5A, IR = 1.0A, Irr = 0.25A 2
Repetitive peak reverse voltage VRRM 1000 V 1
Reverse voltage, total rms value VR(RMS) 700 V 1
Forward current IF 3 A 1
Surge peak forward current IFSM 80 A 8.3 ms single half sine-wave superimposed on rated load 1
Junction temperature TJ -55 150 °C 1
Storage temperature TSTG -55 150 °C 1
Junction-to-lead thermal resistance RΘJL 23 °C/W 2
Junction-to-ambient thermal resistance RΘJA 88 °C/W 2
Junction-to-case thermal resistance RΘJC 24 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test 1

CAD (KiCad official)

  • Symbol: RS3MFSH
  • Footprint: Diode_SMD:D_SOD-128
  • 3D model: SOD-128 (KiCad packages3D, STEP)
  • 3D model files: rs3mfsh-etched.step / rs3mfsh-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs3mfsh.step / rs3mfsh.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor datasheet (5 pp, sha256 a89154b1faaefc42, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF