RS3MFSH
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Taiwan Semiconductor Fast Recovery / High Efficiency Diodes, SOD-128. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
RS3MFSH
Taiwan Semiconductor · Fast Recovery / High Efficiency Diodes · SOD-128
RS3MFSH from Taiwan Semiconductor, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage | VF | 1.1 | 1.21 | V | IF = 1.5A, TJ = 25°C | 2 | |
| Forward voltage | VF | 1.2 | 1.3 | V | IF = 3.0A, TJ = 25°C | 2 | |
| Forward voltage | VF | 0.9 | 1 | V | IF = 1.5A, TJ = 125°C | 2 | |
| Forward voltage | VF | 1.03 | 1.2 | V | IF = 3.0A, TJ = 125°C | 2 | |
| Reverse current | IR | 5 | μA | @ rated VR, TJ = 25°C; pulse test PW = 30ms | 2 | ||
| Reverse current | IR | 250 | μA | @ rated VR, TJ = 150°C; pulse test PW = 30ms | 2 | ||
| Junction capacitance | CJ | 15 | pF | 1MHz, VR = 4.0V | 2 | ||
| Reverse recovery time | trr | 160 | ns | IF = 0.5A, IR = 1.0A, Irr = 0.25A | 2 | ||
| Repetitive peak reverse voltage | VRRM | 1000 | V | 1 | |||
| Reverse voltage, total rms value | VR(RMS) | 700 | V | 1 | |||
| Forward current | IF | 3 | A | 1 | |||
| Surge peak forward current | IFSM | 80 | A | 8.3 ms single half sine-wave superimposed on rated load | 1 | ||
| Junction temperature | TJ | -55 | 150 | °C | 1 | ||
| Storage temperature | TSTG | -55 | 150 | °C | 1 | ||
| Junction-to-lead thermal resistance | RΘJL | 23 | °C/W | 2 | |||
| Junction-to-ambient thermal resistance | RΘJA | 88 | °C/W | 2 | |||
| Junction-to-case thermal resistance | RΘJC | 24 | °C/W | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test | 1 |
CAD (KiCad official)
- Symbol:
RS3MFSH - Footprint:
Diode_SMD:D_SOD-128 - 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files:
rs3mfsh-etched.step/rs3mfsh-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs3mfsh.step/rs3mfsh.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Taiwan Semiconductor datasheet (5 pp, sha256
a89154b1faaefc42, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RS3MFSH
**Taiwan Semiconductor** · Fast Recovery / High Efficiency Diodes · SOD-128
RS3MFSH from Taiwan Semiconductor, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward voltage | VF | | 1.1 | 1.21 | V | IF = 1.5A, TJ = 25°C | 2 |
| Forward voltage | VF | | 1.2 | 1.3 | V | IF = 3.0A, TJ = 25°C | 2 |
| Forward voltage | VF | | 0.9 | 1 | V | IF = 1.5A, TJ = 125°C | 2 |
| Forward voltage | VF | | 1.03 | 1.2 | V | IF = 3.0A, TJ = 125°C | 2 |
| Reverse current | IR | | | 5 | μA | @ rated VR, TJ = 25°C; pulse test PW = 30ms | 2 |
| Reverse current | IR | | | 250 | μA | @ rated VR, TJ = 150°C; pulse test PW = 30ms | 2 |
| Junction capacitance | CJ | | 15 | | pF | 1MHz, VR = 4.0V | 2 |
| Reverse recovery time | trr | | | 160 | ns | IF = 0.5A, IR = 1.0A, Irr = 0.25A | 2 |
| Repetitive peak reverse voltage | VRRM | | | 1000 | V | | 1 |
| Reverse voltage, total rms value | VR(RMS) | | | 700 | V | | 1 |
| Forward current | IF | | | 3 | A | | 1 |
| Surge peak forward current | IFSM | | | 80 | A | 8.3 ms single half sine-wave superimposed on rated load | 1 |
| Junction temperature | TJ | -55 | | 150 | °C | | 1 |
| Storage temperature | TSTG | -55 | | 150 | °C | | 1 |
| Junction-to-lead thermal resistance | RΘJL | | 23 | | °C/W | | 2 |
| Junction-to-ambient thermal resistance | RΘJA | | 88 | | °C/W | | 2 |
| Junction-to-case thermal resistance | RΘJC | | 24 | | °C/W | | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test | 1 |
## CAD (KiCad official)
- Symbol: `RS3MFSH`
- Footprint: `Diode_SMD:D_SOD-128`
- 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files: `rs3mfsh-etched.step` / `rs3mfsh-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rs3mfsh.step` / `rs3mfsh.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Taiwan Semiconductor datasheet](docs/rs3mfsh-datasheet.pdf) (5 pp, sha256 `a89154b1faaefc42`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rs3mfsh-datasheet.pdf)