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Contents

README

markdown

RS3MB-13-F

Diodes Incorporated · Diodes - Fast Recovery Rectifiers · SMB

RS3MB-13-F from Diodes Incorporated, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the cathode band or cathode notch; RS3MB blocks up to 1000 V DC (VRRM/VRWM/VR) and conducts 3.0 A average rectified output current.
2 A passive Anode terminal; forward voltage is 1.3 V max at IF = 3.0 A with non-repetitive surge current rating of 100 A.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM/VRWM/VR 1000 V @ TA = 25C 1
RMS Reverse Voltage VR(RMS) 700 V @ TA = 25C 1
Average Rectified Output Current IO 3 A @ TT = 75C 1
Non-Repetitive Peak Forward Surge Current IFSM 100 A 8.3ms Single half sine-wave Superimposed on Rated Load (JEDEC Method) 1
Forward Voltage VFM 1.3 V IF = 3.0A 1
Peak Reverse Current at Rated DC Blocking Voltage IRM 5 A @ TA = 25C 1
Peak Reverse Current at Rated DC Blocking Voltage IRM 250 A @ TA = 125C 1
Maximum Recovery Time trr 500 ns IF = 0.5A, IR = 1.0A, Irr = 0.25A 1
Operating and Storage Temperature Range Tj, TSTG -65 150 C 1
Typical Junction Capacitance Cj 50 pF Measured at 1.0MHz and applied reverse voltage of 4.0V DC 1
Typical Thermal Resistance Junction to Terminal RθJT 25 K/W Unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Notes: 1. Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink. 1

CAD (KiCad official)

  • Symbol: RS3MB-13-F
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: rs3mb-13-f-etched.step / rs3mb-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs3mb-13-f.step / rs3mb-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (2 pp, sha256 83bc05be074fed42, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF