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RS3M
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MSKSEMI Diodes - Fast Recovery Rectifiers, SMB. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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RS3M
MSKSEMI · Diodes - Fast Recovery Rectifiers · SMB
RS3M from MSKSEMI, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature Range | TJ | -55 | 150 | ℃ | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | ℃ | 2 | ||
| Maximum Recurrent Peak Reverse Voltage (RS3M column) | VRRM | 1000 | V | 2 | |||
| Maximum RMS Voltage (RS3M column) | VRMS | 700 | V | 2 | |||
| Maximum DC Blocking Voltage (RS3M column) | VDC | 1000 | V | 2 | |||
| Maximum Average Forward Rectified Current | I(AV) | 3 | A | See Fig. 1 @TL=75OC | 2 | ||
| Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) | IFSM | 100 | A | 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) | 2 | ||
| Maximum Instantaneous Forward Voltage | VF | 1.3 | V | @ 3.0A | 2 | ||
| Maximum DC Reverse Current | IR | 10 | uA | @ TA=25℃ at Rated DC Blocking Voltage | 2 | ||
| Maximum DC Reverse Current | IR | 250 | uA | @ TA=125℃ at Rated DC Blocking Voltage | 2 | ||
| Maximum Reverse Recovery Time (RS3M column) | Trr | 500 | nS | Note 1: IF=0.5A, IR=1.0A, IRR=0.25A | 2 | ||
| Typical Junction Capacitance | Cj | 60 | pF | Note 2: measured at 1 MHz and applied VR=4.0 Volts | 2 | ||
| Typical Thermal Resistance, Junction to Ambient | RθJA | 50 | ℃/W | Note 3: junction to ambient, mounted on P.C.B. with 0.6x0.6 in (16x16 mm) copper pad areas | 2 | ||
| Typical Thermal Resistance, Junction to Lead | RθJL | 15 | ℃/W | Note 3: junction to lead, mounted on P.C.B. with 0.6x0.6 in (16x16 mm) copper pad areas | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | 3. Thermal Resistance from Junction to Ambient and from Junction to Lead Mounted on P.C.B. with 0.6”x0.6” ( 16 x 16 mm ) Copper Pad Areas. | 2 |
CAD (KiCad official)
- Symbol:
RS3M - Footprint:
Diode_SMD:D_SMB - 3D model: SMB (KiCad packages3D, STEP)
- 3D model files:
rs3m-etched.step/rs3m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs3m.step/rs3m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MSKSEMI datasheet (5 pp, sha256
4a88d6fa3b254dbe, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RS3M
**MSKSEMI** · Diodes - Fast Recovery Rectifiers · SMB
RS3M from MSKSEMI, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Temperature Range | TJ | -55 | | 150 | ℃ | | 2 |
| Storage Temperature Range | TSTG | -55 | | 150 | ℃ | | 2 |
| Maximum Recurrent Peak Reverse Voltage (RS3M column) | VRRM | | | 1000 | V | | 2 |
| Maximum RMS Voltage (RS3M column) | VRMS | | | 700 | V | | 2 |
| Maximum DC Blocking Voltage (RS3M column) | VDC | | | 1000 | V | | 2 |
| Maximum Average Forward Rectified Current | I(AV) | | | 3 | A | See Fig. 1 @TL=75OC | 2 |
| Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method) | IFSM | | | 100 | A | 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) | 2 |
| Maximum Instantaneous Forward Voltage | VF | | | 1.3 | V | @ 3.0A | 2 |
| Maximum DC Reverse Current | IR | | | 10 | uA | @ TA=25℃ at Rated DC Blocking Voltage | 2 |
| Maximum DC Reverse Current | IR | | | 250 | uA | @ TA=125℃ at Rated DC Blocking Voltage | 2 |
| Maximum Reverse Recovery Time (RS3M column) | Trr | | | 500 | nS | Note 1: IF=0.5A, IR=1.0A, IRR=0.25A | 2 |
| Typical Junction Capacitance | Cj | | 60 | | pF | Note 2: measured at 1 MHz and applied VR=4.0 Volts | 2 |
| Typical Thermal Resistance, Junction to Ambient | RθJA | | 50 | | ℃/W | Note 3: junction to ambient, mounted on P.C.B. with 0.6x0.6 in (16x16 mm) copper pad areas | 2 |
| Typical Thermal Resistance, Junction to Lead | RθJL | | 15 | | ℃/W | Note 3: junction to lead, mounted on P.C.B. with 0.6x0.6 in (16x16 mm) copper pad areas | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | | 3. Thermal Resistance from Junction to Ambient and from Junction to Lead Mounted on P.C.B. with 0.6”x0.6” ( 16 x 16 mm ) Copper Pad Areas. | 2 |
## CAD (KiCad official)
- Symbol: `RS3M`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB (KiCad packages3D, STEP)
- 3D model files: `rs3m-etched.step` / `rs3m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rs3m.step` / `rs3m.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MSKSEMI datasheet](docs/rs3m-datasheet.pdf) (5 pp, sha256 `4a88d6fa3b254dbe`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rs3m-datasheet.pdf)