component
RS3GC
Public Made by Adomby adom
MDD（Microdiode Electronics） Diodes - Fast Recovery Rectifiers, SMC. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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RS3GC
MDD（Microdiode Electronics） · Diodes - Fast Recovery Rectifiers · SMC
RS3GC from MDD（Microdiode Electronics）, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MDD（Microdiode Electronics） |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 400 | V | 1 | |||
| Maximum RMS voltage | VRMS | 280 | V | 1 | |||
| Maximum DC blocking voltage | VDC | 400 | V | 1 | |||
| Maximum average forward rectified current | I(AV) | 3 | A | 1 | |||
| Peak forward surge current | IFSM | 90 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 | ||
| Maximum instantaneous forward voltage | VF | 1.3 | V | at 3.0A | 1 | ||
| Maximum DC reverse current | IR | 5 | μA | TA=25℃ at rated DC blocking voltage | 1 | ||
| Maximum DC reverse current | IR | 100 | μA | TA=125℃ at rated DC blocking voltage | 1 | ||
| Maximum reverse recovery time | trr | 150 | ns | IF=0.5A, IR=1.0A, Irr=0.25A | 1 | ||
| Operating junction and storage temperature range | TJ,TSTG | -55 | 150 | ℃ | 1 | ||
| Typical junction capacitance | CJ | 40 | pF | 1MHz, applied reverse voltage 4.0V D.C. | 1 | ||
| Typical thermal resistance junction to ambient | RθJA | 45 | ℃/W | P.C.B. mounted with 2.0x2.0 in (5.0x5.0cm) copper pad areas | 1 | ||
| Typical thermal resistance junction to case | RθJC | 15 | ℃/W | P.C.B. mounted with 2.0x2.0 in (5.0x5.0cm) copper pad areas | 1 |
CAD (KiCad official)
- Symbol:
RS3GC - Footprint:
Diode_SMD:D_SMC - 3D model: SMC (KiCad packages3D, STEP)
- 3D model files:
rs3gc-etched.step/rs3gc-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs3gc.step/rs3gc.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: MDD（Microdiode Electronics） datasheet (3 pp, sha256
2d3432fe42459199, retrieved 2026-10-24, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RS3GC
**MDD（Microdiode Electronics）** · Diodes - Fast Recovery Rectifiers · SMC
RS3GC from MDD（Microdiode Electronics）, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | MDD（Microdiode Electronics） |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | | | 400 | V | | 1 |
| Maximum RMS voltage | VRMS | | | 280 | V | | 1 |
| Maximum DC blocking voltage | VDC | | | 400 | V | | 1 |
| Maximum average forward rectified current | I(AV) | | | 3 | A | | 1 |
| Peak forward surge current | IFSM | | | 90 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) | 1 |
| Maximum instantaneous forward voltage | VF | | | 1.3 | V | at 3.0A | 1 |
| Maximum DC reverse current | IR | | | 5 | μA | TA=25℃ at rated DC blocking voltage | 1 |
| Maximum DC reverse current | IR | | | 100 | μA | TA=125℃ at rated DC blocking voltage | 1 |
| Maximum reverse recovery time | trr | | | 150 | ns | IF=0.5A, IR=1.0A, Irr=0.25A | 1 |
| Operating junction and storage temperature range | TJ,TSTG | -55 | | 150 | ℃ | | 1 |
| Typical junction capacitance | CJ | | 40 | | pF | 1MHz, applied reverse voltage 4.0V D.C. | 1 |
| Typical thermal resistance junction to ambient | RθJA | | 45 | | ℃/W | P.C.B. mounted with 2.0x2.0 in (5.0x5.0cm) copper pad areas | 1 |
| Typical thermal resistance junction to case | RθJC | | 15 | | ℃/W | P.C.B. mounted with 2.0x2.0 in (5.0x5.0cm) copper pad areas | 1 |
## CAD (KiCad official)
- Symbol: `RS3GC`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC (KiCad packages3D, STEP)
- 3D model files: `rs3gc-etched.step` / `rs3gc-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rs3gc.step` / `rs3gc.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [MDD（Microdiode Electronics） datasheet](docs/rs3gc-datasheet.pdf) (3 pp, sha256 `2d3432fe42459199`, retrieved 2026-10-24, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rs3gc-datasheet.pdf)