# RS3BC

**Shandong Jingdao Microelectronics** · Fast Recovery / High Efficiency Diodes · SMC

RS3BC from Shandong Jingdao Microelectronics, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the rectifier diode, per the datasheet pinning table (Pin 1 = Cathode); the datasheet gives no separate pin-level electrical limits. |
| 2 | Anode | passive | Anode terminal of the rectifier diode, per the datasheet pinning table (Pin 2 = Anode); the datasheet gives no separate pin-level electrical limits. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | SMC |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Peak Reverse Voltage | VRRM |  |  | 100 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 70 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 100 | V |  | 1 |
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 3 | A | Single phase, half wave, 60 Hz, resistive or inductive load; derate current 20% for capacitive load | 1 |
| Peak Forward Surge Current | IFSM |  |  | 90 | A | 8.3 ms single half sine wave superimposed on rated load | 1 |
| Maximum Forward Voltage | VF |  |  | 1.3 | V | at 3 A | 1 |
| Maximum DC Reverse Current | IR |  |  | 5 | μA | Ta = 25 °C, at rated DC blocking voltage | 1 |
| Maximum DC Reverse Current | IR |  |  | 100 | μA | Ta = 125 °C, at rated DC blocking voltage | 1 |
| Typical Junction Capacitance | Cj |  | 40 |  | pF | at VR = 4 V, f = 1 MHz | 1 |
| Operating and Storage Temperature Range | Tj, Tstg | -55 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance, junction to ambient | RθJA |  | 45 |  | °C/W |  | 1 |
| Typical Thermal Resistance, junction to case | RθJC |  | 15 |  | °C/W |  | 1 |

## CAD (KiCad official)

- Symbol: `RS3BC`
- Footprint: `Diode_SMD:D_SMC`
- 3D model: SMC (KiCad packages3D, STEP)
- 3D model files: `rs3bc-etched.step` / `rs3bc-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rs3bc.step` / `rs3bc.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shandong Jingdao Microelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588911816985989120) (3 pp, sha256 `81ca06cc535851b4`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/rs3bc-datasheet.pdf)