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RS3112-2.5XK
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Jiangsu RUNIC Tech Voltage Reference, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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RS3112-2.5XK
Jiangsu RUNIC Tech · Voltage Reference · SOP-8
RS3112-2.5XK from Jiangsu RUNIC Tech, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
| 2 | VIN | power_in | Input supply voltage, referenced to GND, that must be at least VOUT + 0.3 V (2.8 V for the 2.5 V option) and no more than 5 V recommended (5.5 V absolute maximum). |
| 3 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
| 4 | GND | power_in | Ground reference for all voltages; the datasheet states that all voltages are measured with respect to the GND pin. |
| 5 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
| 6 | OUT | output | Reference output voltage (2.5 V nominal for this option) that sources or sinks up to ±10 mA and requires a 1 µF to 50 µF capacitor from OUT to GND. |
| 7 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
| 8 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Jiangsu RUNIC Tech |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, V+ to V- | VIN | -0.2 | 5.5 | V | 6 | ||
| Output short circuit | -30 | 30 | mA | 6 | |||
| Operating temperature | TA | -40 | 125 | °C | 6 | ||
| Junction temperature | TJ | -40 | 150 | °C | 6 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| Input voltage (recommended) | VIN | 5 | V | 6 | |||
| Load current | ILoad | -10 | 10 | mA | 6 | ||
| Initial Accuracy | -0.1 | 0.1 | % | All voltage options | 7 | ||
| Output Voltage Temperature Drift | dVOUT/dT | 4 | 20 | ppm/°C | TA = -40°C to +125°C | 7 | |
| Line Regulation | 40 | 65 | ppm/V | VIN = (VOUT + 0.3) to 5.5 V | 7 | ||
| Line Regulation (over temperature) | 150 | ppm/V | VIN = (VOUT + 0.3) to 5.5 V, TA = -40°C to +125°C | 7 | |||
| Load Regulation | dVOUT/dILOAD | 3 | 10 | ppm/mA | -10 mA < ILOAD < 10 mA, VIN = VOUT + 0.3 V | 7 | |
| Load Regulation (over temperature) | dVOUT/dILOAD | 30 | ppm/mA | -10 mA < ILOAD < 10 mA, VIN = VOUT + 0.3 V, TA = -40°C to 125°C | 7 | ||
| Capacitive Load | 1 | 50 | µF | 7 | |||
| Supply Voltage (VIN) | VIN | 5.5 | V | ILOAD = 0, TA = -40°C to +125°C | 7 | ||
| Quiescent Current | IQ | 150 | 180 | µA | ILOAD = 0, TA = 25°C | 7 | |
| Quiescent Current (over temperature) | IQ | 220 | µA | ILOAD = 0, TA = -40°C to +125°C | 7 | ||
| Package thermal impedance, junction-to-ambient, SOIC-8(SOP8) | θJA | 110.88 | °C/W | 6 |
CAD (KiCad official)
- Symbol:
RS3112-2.5XK - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
rs3112-2-5xk-etched.step/rs3112-2-5xk-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs3112-2-5xk.step/rs3112-2-5xk.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Jiangsu RUNIC Tech datasheet (18 pp, sha256
fac1883cc990e756, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RS3112-2.5XK
**Jiangsu RUNIC Tech** · Voltage Reference · SOP-8
RS3112-2.5XK from Jiangsu RUNIC Tech, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
| 2 | VIN | power_in | Input supply voltage, referenced to GND, that must be at least VOUT + 0.3 V (2.8 V for the 2.5 V option) and no more than 5 V recommended (5.5 V absolute maximum). |
| 3 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
| 4 | GND | power_in | Ground reference for all voltages; the datasheet states that all voltages are measured with respect to the GND pin. |
| 5 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
| 6 | OUT | output | Reference output voltage (2.5 V nominal for this option) that sources or sinks up to ±10 mA and requires a 1 µF to 50 µF capacitor from OUT to GND. |
| 7 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
| 8 | NC | unconnected | No internal connection; the datasheet recommends tying it to GND, typically a heat-spreading plane, for thermal purposes. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Jiangsu RUNIC Tech |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, V+ to V- | VIN | -0.2 | | 5.5 | V | | 6 |
| Output short circuit | | -30 | | 30 | mA | | 6 |
| Operating temperature | TA | -40 | | 125 | °C | | 6 |
| Junction temperature | TJ | -40 | | 150 | °C | | 6 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 6 |
| Input voltage (recommended) | VIN | | | 5 | V | | 6 |
| Load current | ILoad | -10 | | 10 | mA | | 6 |
| Initial Accuracy | | -0.1 | | 0.1 | % | All voltage options | 7 |
| Output Voltage Temperature Drift | dVOUT/dT | | 4 | 20 | ppm/°C | TA = -40°C to +125°C | 7 |
| Line Regulation | | | 40 | 65 | ppm/V | VIN = (VOUT + 0.3) to 5.5 V | 7 |
| Line Regulation (over temperature) | | | | 150 | ppm/V | VIN = (VOUT + 0.3) to 5.5 V, TA = -40°C to +125°C | 7 |
| Load Regulation | dVOUT/dILOAD | | 3 | 10 | ppm/mA | -10 mA < ILOAD < 10 mA, VIN = VOUT + 0.3 V | 7 |
| Load Regulation (over temperature) | dVOUT/dILOAD | | | 30 | ppm/mA | -10 mA < ILOAD < 10 mA, VIN = VOUT + 0.3 V, TA = -40°C to 125°C | 7 |
| Capacitive Load | | 1 | | 50 | µF | | 7 |
| Supply Voltage (VIN) | VIN | | | 5.5 | V | ILOAD = 0, TA = -40°C to +125°C | 7 |
| Quiescent Current | IQ | | 150 | 180 | µA | ILOAD = 0, TA = 25°C | 7 |
| Quiescent Current (over temperature) | IQ | | | 220 | µA | ILOAD = 0, TA = -40°C to +125°C | 7 |
| Package thermal impedance, junction-to-ambient, SOIC-8(SOP8) | θJA | | 110.88 | | °C/W | | 6 |
## CAD (KiCad official)
- Symbol: `RS3112-2.5XK`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `rs3112-2-5xk-etched.step` / `rs3112-2-5xk-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rs3112-2-5xk.step` / `rs3112-2-5xk.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Jiangsu RUNIC Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590909152942645248) (18 pp, sha256 `fac1883cc990e756`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rs3112-2-5xk-datasheet.pdf)