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RS2G125XM

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Jiangsu RUNIC Tech Logic Gates, MSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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RS2G125XM

Jiangsu RUNIC Tech · Logic Gates · MSOP-8

RS2G125XM from Jiangsu RUNIC Tech, in a MSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OE input Active-low output-enable for buffer 1; when OE is high, output 1Y is forced to high-impedance (Z).
2 1A input Input of buffer 1; inputs accept voltages up to 5.5V, independent of VCC.
3 2Y tri_state 3-state output of buffer 2, high-impedance when 2OE is high; features state ±24mA output drive at VCC=3.0V.
4 GND power_in Ground reference pin for the device.
5 2A input Input of buffer 2; inputs accept voltages up to 5.5V, independent of VCC.
6 1Y tri_state 3-state output of buffer 1, high-impedance when 1OE is high; features state ±24mA output drive at VCC=3.0V.
7 2OE input Active-low output-enable for buffer 2; when OE is high, output 2Y is forced to high-impedance (Z).
8 VCC power_in Supply pin; operating range 1.65V to 5.5V, with data retention down to 1.5V.

Key specifications

Parameter Value
Manufacturer Jiangsu RUNIC Tech
Package MSOP-8
Category Logic
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range VCC -0.5 6.5 V 6
Input voltage range VI -0.5 6.5 V 6
Voltage applied to any output in the high-impedance or power-off state Vo -0.5 6.5 V 6
Voltage applied to any output in the high or low state Vo -0.5 V Max printed as VCC+0.5 V 6
Input clamp current IIK -50 mA VI<0 6
Output clamp current IOK -50 mA VO<0 6
Continuous output current IO -50 50 mA 6
Continuous current through VCC or GND -100 100 mA 6
Junction temperature TJ -65 150 °C 6
Storage temperature Tstg -65 150 °C 6
Supply voltage, operating VCC 1.65 5.5 V Operating 7
Supply voltage, data retention only VCC 1.5 5.5 V Data retention only 7
High-level input voltage VIH 1.7 V VCC=2.3V to 2.7V 7
High-level input voltage VIH 2.2 V VCC=3V to 3.6V 7
Low-level input voltage VIL 0.3 V VCC=2.3V to 2.7V 7
Low-level input voltage VIL 0.4 V VCC=3V to 3.6V 7
Input voltage VI 0 5.5 V 7
Output voltage VO 0 V Max printed as VCC 7
Input transition rise or fall time tr, tf 20 ns/V VCC=1.8V±0.15V, 2.5V±0.2V 7
Input transition rise or fall time tr, tf 10 ns/V VCC=3.3V±0.3V 7
Input transition rise or fall time tr, tf 5 ns/V VCC=5V±0.5V 7
Operating temperature TA -40 125 °C 7
High-level output voltage VOH 1.2 V IOH = -4mA; VCC=1.65V 7
High-level output voltage VOH 1.9 V IOH = -8mA; VCC=2.3V 7
High-level output voltage VOH 2.4 V IOH = -16mA; VCC=3V 7
High-level output voltage VOH 2.3 V IOH = -24mA; VCC=3V 7
High-level output voltage VOH 3.8 V IOH = -32mA; VCC=4.5V 7
Low-level output voltage VOL 0.1 V IOL = 100μA; VCC=1.65V to 5.5V; Full 7
Low-level output voltage VOL 0.45 V IOL = 4mA; VCC=1.65V 7
Low-level output voltage VOL 0.3 V IOL = 8mA; VCC=2.3V 7
Low-level output voltage VOL 0.4 V IOL = 16mA; VCC=3V 7
Low-level output voltage VOL 0.55 V IOL = 24mA; VCC=3V 7
Input current, A or OE inputs II -1 0.1 1 µA VI=5.5V or GND; VCC=0V to 5.5V; +25C 7
Input current, A or OE inputs II -5 5 µA VI=5.5V or GND; VCC=0V to 5.5V; Full 7
Power-off leakage current Ioff -1 0.1 1 µA VI or VO=5.5V; VCC=0V; +25C 7
Power-off leakage current Ioff -10 10 µA VI or VO=5.5V; VCC=0V; Full 7
Off-state (high-impedance) output current IOZ 10 µA VO=0V to 5.5V; VCC=3.6V; Full 7
Quiescent supply current ICC 0.1 1 µA VI=5.5V or GND; IO=0; VCC=1.65V to 5.5V; +25C 7
Quiescent supply current ICC 10 µA VI=5.5V or GND; IO=0; VCC=1.65V to 5.5V; Full 7
Additional quiescent supply current per input ΔICC 500 µA One input at VCC-0.6V, other inputs at VCC or GND; VCC=3V to 5.5V; Full 7
Junction-to-ambient thermal resistance RϴJA 165 °C/W 6
Junction-to-case (top) thermal resistance RϴJC(top) 53 °C/W 6
Junction-to-board thermal resistance RϴJB 87 °C/W 6
Junction-to-top characterization parameter ѰJT 4.9 °C/W 6
Junction-to-board characterization parameter ѰJB 85 °C/W 6

CAD (KiCad official)

  • Symbol: RS2G125XM
  • Footprint: Package_SO:MSOP-8_3x3mm_P0.65mm
  • 3D model: MSOP-8 (KiCad packages3D, STEP)
  • 3D model files: rs2g125xm-etched.step / rs2g125xm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs2g125xm.step / rs2g125xm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jiangsu RUNIC Tech datasheet (12 pp, sha256 2b4e87e6048fca71, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF