component
RS2G07XH6
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Jiangsu RUNIC Tech Inverters, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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RS2G07XH6
Jiangsu RUNIC Tech · Inverters · SOT-23-6
RS2G07XH6 from Jiangsu RUNIC Tech, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1A | input | Input 1 of the dual buffer, which accepts voltages up to 5.5V per the datasheet features and must be held at VCC or GND when unused. |
| 2 | GND | power_in | Ground reference pin for the device. |
| 3 | 2A | input | Input 2 of the dual buffer, which accepts voltages up to 5.5V per the datasheet features and must be held at VCC or GND when unused. |
| 4 | 2Y | output | Open-drain output 2, which can be wired to other open-drain outputs for active-low wired-OR or active-high wired-AND functions and has an output voltage range of 0 to 5.5V. |
| 5 | VCC | power_in | Supply pin, operating from 1.65V to 5.5V, with data retention down to 1.5V. |
| 6 | 1Y | output | Open-drain output 1, which can be wired to other open-drain outputs for active-low wired-OR or active-high wired-AND functions and has an output voltage range of 0 to 5.5V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Jiangsu RUNIC Tech |
| Package | SOT-23-6 |
| Category | Logic |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, operating | VCC | 1.65 | 5.5 | V | Operating | 7 | |
| Supply voltage, data retention only | VCC | 1.5 | V | Data retention only | 7 | ||
| High-level input voltage | VIH | 0.65 | xVCC | VCC=1.65V to 1.95V | 7 | ||
| High-level input voltage | VIH | 1.7 | V | VCC=2.3V to 2.7V | 7 | ||
| High-level input voltage | VIH | 2.2 | V | VCC=3V to 3.6V | 7 | ||
| High-level input voltage | VIH | 0.7 | xVCC | VCC=4.5V to 5.5V | 7 | ||
| Low-level input voltage | VIL | 0.15 | xVCC | VCC=1.65V to 1.95V | 7 | ||
| Low-level input voltage | VIL | 0.3 | V | VCC=2.3V to 2.7V | 7 | ||
| Low-level input voltage | VIL | 0.4 | V | VCC=3V to 3.6V | 7 | ||
| Input voltage | VI | 0 | 5.5 | V | 7 | ||
| Output voltage | VO | 0 | 5.5 | V | 7 | ||
| Input transition rise or fall rate | Δt/Δv | 20 | ns/V | VCC=1.8V±0.15V, 2.5V±0.2V | 7 | ||
| Input transition rise or fall rate | Δt/Δv | 10 | ns/V | VCC=3.3V±0.3V | 7 | ||
| Input transition rise or fall rate | Δt/Δv | 5 | ns/V | VCC=5V±0.5V | 7 | ||
| Operating temperature | TA | -40 | 125 | °C | 7 | ||
| Supply voltage range | VCC | -0.5 | 6.5 | V | 6 | ||
| Input voltage range | VI | -0.5 | 6.5 | V | 6 | ||
| Output voltage range | VO | -0.5 | 6.5 | V | 6 | ||
| Input clamp current | IIK | -50 | mA | VI<0 | 6 | ||
| Output clamp current | IOK | -50 | mA | VO<0 | 6 | ||
| Continuous output current | IO | -50 | 50 | mA | 6 | ||
| Continuous current through VCC or GND | -100 | 100 | mA | 6 | |||
| Junction temperature | TJ | -65 | 150 | °C | 6 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| Electrostatic discharge, human-body model | V(ESD) | -6000 | 6000 | V | HBM, per ANSI/ESDA/JEDEC JS-001 | 6 | |
| Electrostatic discharge, charged device model | V(ESD) | -1500 | 1500 | V | CDM, per ANSI/ESDA/JEDEC JS-002 | 6 | |
| Electrostatic discharge, machine model | V(ESD) | -350 | 350 | V | MM | 6 | |
| Low-level output voltage | VOL | 0.1 | V | IOL = 100μA, VCC 1.65V to 5.5V, Full | 8 | ||
| Low-level output voltage | VOL | 0.45 | V | IOL = 4mA, VCC=1.65V | 8 | ||
| Low-level output voltage | VOL | 0.3 | V | IOL = 8mA, VCC=2.3V | 8 | ||
| Low-level output voltage | VOL | 0.4 | V | IOL = 16mA, VCC=3V | 8 | ||
| Low-level output voltage | VOL | 0.55 | V | IOL = 24mA | 8 | ||
| Input leakage current | II | -1 | 1 | µA | A or B inputs, VI=5.5V or GND, VCC 0V to 5.5V, +25C | 8 | |
| Input leakage current | II | -5 | 5 | µA | A or B inputs, VI=5.5V or GND, VCC 0V to 5.5V, Full | 8 | |
| Power-off leakage current | Ioff | -1 | 1 | µA | VI or VO=5.5V, VCC=0, +25C | 8 | |
| Power-off leakage current | Ioff | -10 | 10 | µA | VI or VO=5.5V, VCC=0, Full | 8 | |
| Quiescent supply current | ICC | 0.1 | 1 | µA | VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V, +25C | 8 | |
| Quiescent supply current | ICC | 10 | µA | VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V, Full | 8 | ||
| Additional quiescent supply current | ΔICC | 500 | µA | One input at VCC-0.6V, other inputs at VCC or GND, VCC 3V to 5.5V, Full | 8 | ||
| Propagation delay | tpd | 6.4 | ns | VCC=1.8V±0.15V, CL=30pF, RL=1kΩ, Full | 8 | ||
| Propagation delay | tpd | 4.5 | ns | VCC=2.5V±0.2V, CL=30pF, RL=500Ω, Full | 8 | ||
| Propagation delay | tpd | 4.2 | ns | VCC=3.3V±0.3V, CL=50pF, RL=500Ω, Full | 8 | ||
| Propagation delay | tpd | 3.7 | ns | VCC=5V±0.5V, CL=50pF, RL=500Ω, Full | 8 | ||
| Input capacitance | Ci | 4 | pF | VCC=3.3V, VI=VCC or GND, +25C | 8 | ||
| Power dissipation capacitance | Cpd | 3 | pF | VCC=1.8V, f=10MHz, +25C | 8 | ||
| Power dissipation capacitance | Cpd | 4 | pF | VCC=3.3V, f=10MHz, +25C | 8 | ||
| Power dissipation capacitance | Cpd | 6 | pF | VCC=5V, f=10MHz, +25C | 8 | ||
| Junction-to-ambient thermal resistance | RθJA | 273.8 | °C/W | SOT23-6 package, soldered to PCB; varies with operating conditions | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 126.8 | °C/W | SOT23-6 package | 6 | ||
| Junction-to-board thermal resistance | RθJB | 85.9 | °C/W | SOT23-6 package | 6 | ||
| Junction-to-top characterization parameter | ΨJT | 10.9 | °C/W | SOT23-6 package | 6 | ||
| Junction-to-board characterization parameter | ΨJB | 84.9 | °C/W | SOT23-6 package | 6 |
CAD (KiCad official)
- Symbol:
RS2G07XH6 - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
rs2g07xh6-etched.step/rs2g07xh6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs2g07xh6.step/rs2g07xh6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Jiangsu RUNIC Tech datasheet (13 pp, sha256
77de2c55f6e6d7a6, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RS2G07XH6
**Jiangsu RUNIC Tech** · Inverters · SOT-23-6
RS2G07XH6 from Jiangsu RUNIC Tech, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1A | input | Input 1 of the dual buffer, which accepts voltages up to 5.5V per the datasheet features and must be held at VCC or GND when unused. |
| 2 | GND | power_in | Ground reference pin for the device. |
| 3 | 2A | input | Input 2 of the dual buffer, which accepts voltages up to 5.5V per the datasheet features and must be held at VCC or GND when unused. |
| 4 | 2Y | output | Open-drain output 2, which can be wired to other open-drain outputs for active-low wired-OR or active-high wired-AND functions and has an output voltage range of 0 to 5.5V. |
| 5 | VCC | power_in | Supply pin, operating from 1.65V to 5.5V, with data retention down to 1.5V. |
| 6 | 1Y | output | Open-drain output 1, which can be wired to other open-drain outputs for active-low wired-OR or active-high wired-AND functions and has an output voltage range of 0 to 5.5V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Jiangsu RUNIC Tech |
| Package | SOT-23-6 |
| Category | Logic |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage, operating | VCC | 1.65 | | 5.5 | V | Operating | 7 |
| Supply voltage, data retention only | VCC | 1.5 | | | V | Data retention only | 7 |
| High-level input voltage | VIH | 0.65 | | | xVCC | VCC=1.65V to 1.95V | 7 |
| High-level input voltage | VIH | 1.7 | | | V | VCC=2.3V to 2.7V | 7 |
| High-level input voltage | VIH | 2.2 | | | V | VCC=3V to 3.6V | 7 |
| High-level input voltage | VIH | 0.7 | | | xVCC | VCC=4.5V to 5.5V | 7 |
| Low-level input voltage | VIL | | | 0.15 | xVCC | VCC=1.65V to 1.95V | 7 |
| Low-level input voltage | VIL | | | 0.3 | V | VCC=2.3V to 2.7V | 7 |
| Low-level input voltage | VIL | | | 0.4 | V | VCC=3V to 3.6V | 7 |
| Input voltage | VI | 0 | | 5.5 | V | | 7 |
| Output voltage | VO | 0 | | 5.5 | V | | 7 |
| Input transition rise or fall rate | Δt/Δv | | | 20 | ns/V | VCC=1.8V±0.15V, 2.5V±0.2V | 7 |
| Input transition rise or fall rate | Δt/Δv | | | 10 | ns/V | VCC=3.3V±0.3V | 7 |
| Input transition rise or fall rate | Δt/Δv | | | 5 | ns/V | VCC=5V±0.5V | 7 |
| Operating temperature | TA | -40 | | 125 | °C | | 7 |
| Supply voltage range | VCC | -0.5 | | 6.5 | V | | 6 |
| Input voltage range | VI | -0.5 | | 6.5 | V | | 6 |
| Output voltage range | VO | -0.5 | | 6.5 | V | | 6 |
| Input clamp current | IIK | | | -50 | mA | VI<0 | 6 |
| Output clamp current | IOK | | | -50 | mA | VO<0 | 6 |
| Continuous output current | IO | -50 | | 50 | mA | | 6 |
| Continuous current through VCC or GND | | -100 | | 100 | mA | | 6 |
| Junction temperature | TJ | -65 | | 150 | °C | | 6 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 6 |
| Electrostatic discharge, human-body model | V(ESD) | -6000 | | 6000 | V | HBM, per ANSI/ESDA/JEDEC JS-001 | 6 |
| Electrostatic discharge, charged device model | V(ESD) | -1500 | | 1500 | V | CDM, per ANSI/ESDA/JEDEC JS-002 | 6 |
| Electrostatic discharge, machine model | V(ESD) | -350 | | 350 | V | MM | 6 |
| Low-level output voltage | VOL | | | 0.1 | V | IOL = 100μA, VCC 1.65V to 5.5V, Full | 8 |
| Low-level output voltage | VOL | | | 0.45 | V | IOL = 4mA, VCC=1.65V | 8 |
| Low-level output voltage | VOL | | | 0.3 | V | IOL = 8mA, VCC=2.3V | 8 |
| Low-level output voltage | VOL | | | 0.4 | V | IOL = 16mA, VCC=3V | 8 |
| Low-level output voltage | VOL | | | 0.55 | V | IOL = 24mA | 8 |
| Input leakage current | II | -1 | | 1 | µA | A or B inputs, VI=5.5V or GND, VCC 0V to 5.5V, +25C | 8 |
| Input leakage current | II | -5 | | 5 | µA | A or B inputs, VI=5.5V or GND, VCC 0V to 5.5V, Full | 8 |
| Power-off leakage current | Ioff | -1 | | 1 | µA | VI or VO=5.5V, VCC=0, +25C | 8 |
| Power-off leakage current | Ioff | -10 | | 10 | µA | VI or VO=5.5V, VCC=0, Full | 8 |
| Quiescent supply current | ICC | | 0.1 | 1 | µA | VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V, +25C | 8 |
| Quiescent supply current | ICC | | | 10 | µA | VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V, Full | 8 |
| Additional quiescent supply current | ΔICC | | | 500 | µA | One input at VCC-0.6V, other inputs at VCC or GND, VCC 3V to 5.5V, Full | 8 |
| Propagation delay | tpd | | | 6.4 | ns | VCC=1.8V±0.15V, CL=30pF, RL=1kΩ, Full | 8 |
| Propagation delay | tpd | | | 4.5 | ns | VCC=2.5V±0.2V, CL=30pF, RL=500Ω, Full | 8 |
| Propagation delay | tpd | | | 4.2 | ns | VCC=3.3V±0.3V, CL=50pF, RL=500Ω, Full | 8 |
| Propagation delay | tpd | | | 3.7 | ns | VCC=5V±0.5V, CL=50pF, RL=500Ω, Full | 8 |
| Input capacitance | Ci | | 4 | | pF | VCC=3.3V, VI=VCC or GND, +25C | 8 |
| Power dissipation capacitance | Cpd | | 3 | | pF | VCC=1.8V, f=10MHz, +25C | 8 |
| Power dissipation capacitance | Cpd | | 4 | | pF | VCC=3.3V, f=10MHz, +25C | 8 |
| Power dissipation capacitance | Cpd | | 6 | | pF | VCC=5V, f=10MHz, +25C | 8 |
| Junction-to-ambient thermal resistance | RθJA | | 273.8 | | °C/W | SOT23-6 package, soldered to PCB; varies with operating conditions | 6 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 126.8 | | °C/W | SOT23-6 package | 6 |
| Junction-to-board thermal resistance | RθJB | | 85.9 | | °C/W | SOT23-6 package | 6 |
| Junction-to-top characterization parameter | ΨJT | | 10.9 | | °C/W | SOT23-6 package | 6 |
| Junction-to-board characterization parameter | ΨJB | | 84.9 | | °C/W | SOT23-6 package | 6 |
## CAD (KiCad official)
- Symbol: `RS2G07XH6`
- Footprint: `Package_TO_SOT_SMD:SOT-23-6`
- 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files: `rs2g07xh6-etched.step` / `rs2g07xh6-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rs2g07xh6.step` / `rs2g07xh6.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Jiangsu RUNIC Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603151370136530944) (13 pp, sha256 `77de2c55f6e6d7a6`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rs2g07xh6-datasheet.pdf)