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RS2G04XC6

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Jiangsu RUNIC Tech Inverters, SC70-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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RS2G04XC6

Jiangsu RUNIC Tech · Inverters · SC70-6

RS2G04XC6 from Jiangsu RUNIC Tech, in a SC70-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Input 1 of inverter 1, which accepts input voltages up to 5.5 V.
2 GND power_in Ground reference pin for the device.
3 2A input Input 2 of inverter 2, which accepts input voltages up to 5.5 V and supports partial-power-down (Ioff) operation.
4 2Y output Output 2 of inverter 2, with high output drive of ±24 mA at VCC = 3.0 V.
5 VCC power_in Supply pin; the operating supply range is 1.65 V to 5.5 V.
6 1Y output Output 1 of inverter 1, with high output drive of ±24 mA at VCC = 3.0 V.

Key specifications

Parameter Value
Manufacturer Jiangsu RUNIC Tech
Package SC70-6
Category Logic
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range VCC -0.5 6.5 V 6
Input voltage range VI -0.5 6.5 V 6
Voltage range applied to any output in the high-impedance or power-off state Vo -0.5 6.5 V high-impedance or power-off state 6
Input clamp current IIK -50 mA VI<0 6
Output clamp current IOK -50 mA VO<0 6
Continuous output current IO -50 50 mA 6
Continuous current through VCC or GND -100 100 mA 6
Junction temperature TJ -65 150 °C 6
Storage temperature Tstg -65 150 °C 6
Supply voltage VCC 1.65 5.5 V Operating 7
Supply voltage (data retention) VCC 1.5 V Data retention only 7
High-level input voltage VIH 1.7 V VCC=2.3V to 2.7V 7
High-level input voltage VIH 2 V VCC=3V to 3.6V 7
Low-level input voltage VIL 0.7 V VCC=2.3V to 2.7V 7
Low-level input voltage VIL 0.8 V VCC=3V to 3.6V 7
Input voltage VI 0 5.5 V 7
Output voltage VO 0 5.5 V 7
Input transition rise or fall rate Δt/Δv 20 ns/V VCC=1.8V±0.15V, 2.5V±0.2V 7
Input transition rise or fall rate Δt/Δv 10 ns/V VCC=3.3V±0.3V 7
Input transition rise or fall rate Δt/Δv 5 ns/V VCC=5V±0.5V 7
Operating temperature TA -40 125 °C 7
High-level output voltage VOH 1.2 V IOH = -4mA, VCC=1.65V 8
High-level output voltage VOH 1.9 V IOH = -8mA, VCC=2.3V 8
High-level output voltage VOH 2.4 V IOH = -16mA, VCC=3V 8
High-level output voltage VOH 2.3 V IOH = -24mA, VCC=3V 8
High-level output voltage VOH 3.8 V IOH = -32mA, VCC=4.5V 8
Low-level output voltage VOL 0.1 V IOL = 100µA, VCC=1.65V to 5.5V, Full 8
Low-level output voltage VOL 0.45 V IOL = 4mA, VCC=1.65V 8
Low-level output voltage VOL 0.3 V IOL = 8mA, VCC=2.3V 8
Low-level output voltage VOL 0.4 V IOL = 16mA, VCC=3V 8
Low-level output voltage VOL 0.55 V IOL = 24mA, VCC=3V 8
A input leakage current II -1 0.1 1 µA VI=5.5V or GND, VCC 0V to 5.5V, +25°C 8
A input leakage current II -5 5 µA VI=5.5V or GND, VCC 0V to 5.5V, Full 8
Partial-power-down leakage current Ioff -1 0.1 1 µA VI or VO=5.5V, VCC=0V, +25°C 8
Partial-power-down leakage current Ioff -10 10 µA VI or VO=5.5V, VCC=0V, Full 8
Quiescent supply current ICC 0.1 1 µA VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V, +25°C 8
Quiescent supply current ICC 10 µA VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V, Full 8
Additional quiescent supply current per input ΔICC 500 µA One input at VCC-0.6V, other inputs at VCC or GND, VCC 3V to 5.5V, Full 8
Propagation delay tpd 13 ns VCC=1.8V±0.15V, CL=30pF, RL=1KΩ 8
Propagation delay tpd 5.1 ns VCC=2.5V±0.2V, CL=30pF, RL=500Ω 8
Propagation delay tpd 4.2 ns VCC=3.3V±0.3V, CL=50pF, RL=500Ω 8
Propagation delay tpd 3.3 ns VCC=5V±0.5V, CL=50pF, RL=500Ω 8
Input capacitance Ci 4 pF VI=VCC or GND, VCC=3.3V, +25°C 8
Power dissipation capacitance Cpd 16 pF VCC=1.8V, f=10MHz 8
Power dissipation capacitance Cpd 18 pF VCC=2.5V, f=10MHz 8
Power dissipation capacitance Cpd 20 pF VCC=5V, f=10MHz 8
Package thermal impedance, SOT363(SC70-6) θJA 265 °C/W SOT363(SC70-6), soldered to PCB, JESD-51 6

CAD (KiCad official)

  • Symbol: RS2G04XC6
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SC70-6 (KiCad packages3D, STEP)
  • 3D model files: rs2g04xc6-etched.step / rs2g04xc6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs2g04xc6.step / rs2g04xc6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jiangsu RUNIC Tech datasheet (13 pp, sha256 a99e31bd1d6a4cb3, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF