component

RS1MFA

Public Made by Adom

by adom

onsemi Fast Recovery / High Efficiency Diodes, SOD-123 FL. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

Schematic Symbol

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PCB Footprint

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Datasheet

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Contents

README

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RS1MFA

onsemi · Fast Recovery / High Efficiency Diodes · SOD-123 FL

RS1MFA from onsemi, in a SOD-123 FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal, identified by the color band on the package; the RS1MFA is rated for a repetitive peak reverse voltage (VRRM) of 1000 V.
2 Anode passive Anode terminal; the device is rated for an average forward rectified current (IF(AV)) of 0.8 A.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123 FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive Peak Reverse Voltage VRRM 1000 V 2
RMS Reverse Voltage VRMS 700 V 2
DC Blocking Voltage VR 1000 V 2
Average Forward Rectified Current IF(AV) 0.8 A 2
Peak Forward Surge Current IFSM 30 A 8.3 ms single half sine-wave superimposed on rated load 2
Operating Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2
Instantaneous Forward Voltage VF 1.3 V IF = 0.8 A 2
Reverse Current at Rated VR IR 5 A TJ = 25°C 2
Reverse Current at Rated VR IR 50 A TJ = 125°C 2
Reverse Recovery Time Trr 500 ns IF = 0.5 A, IR = 1 A, Irr = 0.25 A 2
Typical Thermal Resistance, Junction-to-Lead JL 32 °C/W Device mounted on 5 mm x 5 mm Cu pad PCB (Note 1) 2
Typical Thermal Resistance, Junction-to-Ambient RJA 105 °C/W Device mounted on 5 mm x 5 mm Cu pad PCB (Note 1) 2

CAD (KiCad official)

  • Symbol: RS1MFA
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 FL (KiCad packages3D, STEP)
  • 3D model files: rs1mfa-etched.step / rs1mfa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs1mfa.step / rs1mfa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 5997639e6914c1cb, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF