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RS1G07XF5

Public Made by Adom

by adom

Jiangsu RUNIC Tech Buffers, Drivers, Receivers, Transceivers, SOT23-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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RS1G07XF5

Jiangsu RUNIC Tech · Buffers, Drivers, Receivers, Transceivers · SOT23-5

RS1G07XF5 from Jiangsu RUNIC Tech, in a SOT23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N.C. unconnected Not connected; the pin description table lists this pin as N.C. with no function.
2 A input Single buffer input; input voltage range is 0 to 5.5 V, and unused inputs must be held at VCC or GND for proper operation.
3 GND power_in Ground reference pin for the device.
4 Y output Open-drain output (can be wired-OR/wired-AND with other open-drain outputs); output voltage range is 0 to 5.5 V and continuous output current is limited to ±50 mA.
5 VCC power_in Supply pin; operating supply range is 1.65 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Jiangsu RUNIC Tech
Package SOT23-5
Category Logic
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous output current IO -50 50 mA 4
Continuous current through VCC or GND -100 100 mA 4
Supply voltage range VCC -0.5 6.5 V 4
Input voltage range VI -0.5 6.5 V 4
Output voltage range VO -0.5 6.5 V 4
Input clamp current IIK -50 mA VI<0 4
Output clamp current IOK -50 mA VO<0 4
Junction temperature TJ -65 150 °C 4
Storage temperature Tstg -65 150 °C 4
Electrostatic discharge, Human-body model (HBM) V(ESD) -7500 7500 V Human-body model (HBM) 4
Electrostatic discharge, Charged device model (CDM) V(ESD) -1500 1500 V Charged device model (CDM) 4
Electrostatic discharge, Machine model (MM) V(ESD) -200 200 V Machine model (MM) 4
Supply voltage, operating VCC 1.65 5.5 V Operating 6
Supply voltage, data retention VCC 1.5 V Data retention only 6
High-level input voltage VIH 1.7 V VCC=2.3V to 2.7V 6
High-level input voltage VIH 2.2 V VCC=3V to 3.6V 6
Low-level input voltage VIL 0.3 V VCC=2.3V to 2.7V 6
Low-level input voltage VIL 0.4 V VCC=3V to 3.6V 6
Input voltage VI 0 5.5 V 6
Output voltage VO 0 5.5 V 6
Input transition rise or fall rate Δt/Δv 20 ns/V VCC=1.8V±0.15V, 2.5V±0.2V 6
Input transition rise or fall rate Δt/Δv 10 ns/V VCC=3.3V±0.3V 6
Input transition rise or fall rate Δt/Δv 5 ns/V VCC=5V±0.5V 6
Operating temperature TA -40 125 °C 6
Low-level output voltage VOL 0.1 V IOL=100µA, VCC 1.65V to 5.5V, Full temp 7
Low-level output voltage VOL 0.45 V IOL=4mA, VCC=1.65V 7
Low-level output voltage VOL 0.3 V IOL=8mA, VCC=2.3V 7
Low-level output voltage VOL 0.4 V IOL=16mA, VCC=3V 7
Low-level output voltage VOL 0.55 V IOL=24mA, VCC=3V 7
A input leakage current II -1 1 µA +25C, VI=5.5V or GND, VCC 0V to 5.5V 7
A input leakage current II -5 5 µA Full temp, VI=5.5V or GND, VCC 0V to 5.5V 7
Power-off leakage current Ioff -1 1 µA +25C, VI or VO=5.5V, VCC=0 7
Power-off leakage current Ioff -10 10 µA Full temp, VI or VO=5.5V, VCC=0 7
Supply current ICC 0.1 1 µA +25C, VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V 7
Supply current ICC 10 µA Full temp, VI=5.5V or GND, IO=0, VCC 1.65V to 5.5V 7
Additional supply current per input ΔICC 500 µA One input at VCC-0.6V, other inputs at VCC or GND, VCC 3V to 5.5V, Full temp 7
Propagation delay tpd 6.4 ns VCC=1.8V±0.15V, CL=30pF, RL=1kΩ, Full temp 7
Propagation delay tpd 4.5 ns VCC=2.5V±0.2V, CL=30pF, RL=500Ω, Full temp 7
Propagation delay tpd 4.2 ns VCC=3.3V±0.3V, CL=50pF, RL=500Ω, Full temp 7
Propagation delay tpd 3.7 ns VCC=5V±0.5V, CL=50pF, RL=500Ω, Full temp 7
Input capacitance Ci 4 pF VCC=3.3V, VI=VCC or GND, +25C 7
Power dissipation capacitance Cpd 3 pF VCC=1.8V, f=10MHz, +25C 7
Power dissipation capacitance Cpd 4 pF VCC=3.3V, f=10MHz, +25C 7
Power dissipation capacitance Cpd 6 pF VCC=5V, f=10MHz, +25C 7
Junction-to-ambient thermal resistance RθJA 273.8 °C/W SOT23-5 package 4
Junction-to-case (top) thermal resistance RθJC(top) 126.8 °C/W SOT23-5 package 4
Junction-to-board thermal resistance RθJB 85.9 °C/W SOT23-5 package 4
Junction-to-top characterization parameter ΨJT 10.9 °C/W SOT23-5 package 4
Junction-to-board characterization parameter ΨJB 84.9 °C/W SOT23-5 package 4

CAD (KiCad official)

  • Symbol: RS1G07XF5
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT23-5 (KiCad packages3D, STEP)
  • 3D model files: rs1g07xf5-etched.step / rs1g07xf5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rs1g07xf5.step / rs1g07xf5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jiangsu RUNIC Tech datasheet (11 pp, sha256 ce0180d00a4b67e2, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF