component
RS1AFA
Public Made by Adomby adom
onsemi Fast Recovery / High Efficiency Diodes, SOD-123 FL. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownRS1AFA
onsemi · Fast Recovery / High Efficiency Diodes · SOD-123 FL
RS1AFA from onsemi, in a SOD-123 FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal, identified on the package by the color band; the datasheet states no pin-specific electrical limits for it. |
| 2 | Anode | passive | Anode terminal of the rectifier; the datasheet states no pin-specific electrical limits for it. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOD-123 FL |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Repetitive Peak Reverse Voltage | VRRM | 50 | V | 2 | |||
| RMS Reverse Voltage | VRMS | 35 | V | 2 | |||
| DC Blocking Voltage | VR | 50 | V | 2 | |||
| Average Forward Rectified Current | IF(AV) | 0.8 | A | 2 | |||
| Peak Forward Surge Current | IFSM | 30 | A | 8.3 ms Single Half Sine-Wave Superimposed on Rated Load | 2 | ||
| Operating Junction Temperature Range | TJ | -55 | 150 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 150 | °C | 2 | ||
| Instantaneous Forward Voltage | VF | 1.3 | V | IF = 0.8 A | 2 | ||
| Reverse Current at Rated VR | IR | 5 | A | TJ = 25°C | 2 | ||
| Reverse Current at Rated VR | IR | 50 | A | TJ = 125°C | 2 | ||
| Reverse Recovery Time (RS1AFA, RS1BFA, RS1DFA row) | Trr | 150 | ns | IF = 0.5 A, IR = 1 A, Irr = 0.25 A | 2 | ||
| Typical Junction-to-Lead Thermal Resistance | JL | 32 | °C/W | Note 1: device mounted on 5 mm x 5 mm Cu pad PCB | 2 | ||
| Typical Thermal Resistance, Junction-to-Ambient | RJA | 105 | °C/W | Note 1: device mounted on 5 mm x 5 mm Cu pad PCB | 2 |
CAD (KiCad official)
- Symbol:
RS1AFA - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123 FL (KiCad packages3D, STEP)
- 3D model files:
rs1afa-etched.step/rs1afa-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rs1afa.step/rs1afa.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (5 pp, sha256
5997639e6914c1cb, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).