component
RGF1J
Public Made by Adomby adom
onsemi Fast Recovery / High Efficiency Diodes, SMA(DO-214AC). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
main
RGF1J
onsemi · Fast Recovery / High Efficiency Diodes · SMA(DO-214AC)
RGF1J from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Reverse Voltage | VRRM | 600 | V | 2 | |||
| Average Rectified Forward Current | IF(AV) | 1 | A | TL = 125°C | 2 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 30 | A | 8.3 ms Single Half-Sine Wave | 2 | ||
| Operating Junction Temperature | TJ | -65 | 175 | °C | 2 | ||
| Storage Temperature Range | TSTG | -65 | 175 | °C | 2 | ||
| Power Dissipation | PD | 1.76 | W | TA = 25°C | 2 | ||
| Junction-to-Ambient Thermal Resistance | RJA | 85 | °C/W | Note 1: device mounted on FR-4 PCB 0.013 mm | 2 | ||
| Junction-to-Lead Thermal Resistance | RJL | 28 | °C/W | Note 1: device mounted on FR-4 PCB 0.013 mm | 2 | ||
| Maximum Forward Voltage | VF | 1.3 | V | IF = 1.0 A | 2 | ||
| Maximum Reverse Current at Rated VR | IR | 5 | A | at Rated VR, TA = 25°C | 2 | ||
| Maximum Reverse Current at Rated VR | IR | 100 | A | at Rated VR, TA = 125°C | 2 |
CAD (KiCad official)
- Symbol:
RGF1J - Footprint:
Diode_SMD:D_SMA - 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files:
rgf1j-etched.step/rgf1j-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rgf1j.step/rgf1j.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (5 pp, sha256
922fcdce73bdaed6, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RGF1J
**onsemi** · Fast Recovery / High Efficiency Diodes · SMA(DO-214AC)
RGF1J from onsemi, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SMA(DO-214AC) |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Repetitive Reverse Voltage | VRRM | | | 600 | V | | 2 |
| Average Rectified Forward Current | IF(AV) | | | 1 | A | TL = 125°C | 2 |
| Non-Repetitive Peak Forward Surge Current | IFSM | | | 30 | A | 8.3 ms Single Half-Sine Wave | 2 |
| Operating Junction Temperature | TJ | -65 | | 175 | °C | | 2 |
| Storage Temperature Range | TSTG | -65 | | 175 | °C | | 2 |
| Power Dissipation | PD | | | 1.76 | W | TA = 25°C | 2 |
| Junction-to-Ambient Thermal Resistance | RJA | | | 85 | °C/W | Note 1: device mounted on FR-4 PCB 0.013 mm | 2 |
| Junction-to-Lead Thermal Resistance | RJL | | | 28 | °C/W | Note 1: device mounted on FR-4 PCB 0.013 mm | 2 |
| Maximum Forward Voltage | VF | | | 1.3 | V | IF = 1.0 A | 2 |
| Maximum Reverse Current at Rated VR | IR | | | 5 | A | at Rated VR, TA = 25°C | 2 |
| Maximum Reverse Current at Rated VR | IR | | | 100 | A | at Rated VR, TA = 125°C | 2 |
## CAD (KiCad official)
- Symbol: `RGF1J`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
- 3D model files: `rgf1j-etched.step` / `rgf1j-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rgf1j.step` / `rgf1j.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [onsemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589991667194765312) (5 pp, sha256 `922fcdce73bdaed6`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rgf1j-datasheet.pdf)