component
REF318SOT233
Public Made by Adomby adom
analogysemi Voltage Reference, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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REF318SOT233
analogysemi · Voltage Reference · SOT-23-3
REF318SOT233 from analogysemi, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Supply input voltage; the datasheet recommends VOUT + 0.02 V up to 5.5 V, with an absolute maximum input of 6.5 V, and the device powers up once VIN exceeds VOUT. |
| 2 | OUT | power_out | Reference voltage output that sources or sinks up to ±25 mA over the stated operating conditions, with a 0.1 µF to 10 µF ceramic capacitor recommended for bypass. |
| 3 | GND | power_in | Ground reference pin for the device. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | analogysemi |
| Package | SOT-23-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Initial Accuracy | -0.1 | 0.05 | 0.1 | % | 5 | ||
| Line Regulation | -180 | 3 | 180 | µV/V | VOUT + 0.05V ≤ VIN ≤ 5.5V | 5 | |
| Line Regulation | -230 | 230 | µV/V | −40°C ≤ TA ≤ 125°C, VOUT + 0.05V ≤ VIN ≤ 5.5V | 5 | ||
| Output Voltage Temperature Drift | dVOUT/dT | 5 | 20 | ppm/°C | −40°C ≤ TA ≤ 125°C | 6 | |
| Load Regulation (sourcing) | dVOUT/dLOAD | -30 | -2 | 30 | ppm/mA | Sourcing, 0mA < ILOAD < 25mA, VIN = VOUT + 250mV | 6 |
| Load Regulation (sourcing, temperature) | dVOUT/dLOAD | -30 | 30 | ppm/mA | −40°C ≤ TA ≤ 125°C, sourcing, 0mA < ILOAD < 10mA, VIN = VOUT + 250mV | 6 | |
| Load Regulation (sinking) | dVOUT/dLOAD | -100 | -57 | 100 | ppm/mA | Sinking, −10mA < ILOAD < 0mA, VIN = VOUT + 100mV | 6 |
| Load Regulation (sinking, temperature) | dVOUT/dLOAD | -150 | 150 | ppm/mA | −40°C ≤ TA ≤ 125°C, sinking, −10mA < ILOAD < 0mA, VIN = VOUT + 100mV | 6 | |
| Thermal Hysteresis | dT | -300 | 300 | ppm | First Cycle | 6 | |
| Thermal Hysteresis | dT | -60 | 60 | ppm | Additional Cycles | 6 | |
| Dropout Voltage | 5 | 10 | mV | ILOAD = 50µA, output ≤ 2.048V | 6 | ||
| Output Current | ILOAD | -25 | 25 | mA | output > 2.048V, VIN = VOUT + 250mV; output ≤ 2.048V, VIN = VOUT + 400mV | 6 | |
| Input Voltage | VIN | 5.5 | V | Voltage VIN; minimum printed as VOUT + 0.002 (expression, not numeric) | 7 | ||
| Quiescent Current | IQ | 60 | 80 | µA | IL = 0 | 7 | |
| Temperature Range, Specified | -40 | 125 | °C | 7 | |||
| Temperature Range, Operating | TA | -55 | 135 | °C | 7 | ||
| Temperature Range, Storage | -65 | 150 | °C | 7 | |||
| Supply Input Voltage | VIN | 5.5 | V | Minimum printed as VOUT + 0.02 (expression, not numeric) | 4 | ||
| Output Current Range | IOUT | -25 | 25 | mA | 4 | ||
| Operating Temperature | TA | -55 | 135 | °C | 4 | ||
| Input Voltage (absolute maximum) | VIN | 6.5 | V | 3 | |||
| Output Voltage (absolute maximum) | VOUT | 5 | V | 3 | |||
| Operating Temperature (absolute maximum) | TA | -55 | 150 | °C | 3 | ||
| Junction Temperature (absolute maximum) | TJ | 150 | °C | 3 | |||
| ESD Human-Body Model | V(ESD) | -8000 | 8000 | V | HBM, per ANSI/ESDA/JEDEC JS-001 | 3 | |
| ESD Charged-Device Model | V(ESD) | -2000 | 2000 | V | CDM, per JEDEC JESD22-C101 | 3 | |
| Junction-to-Ambient Thermal Resistance | RθJA | 176.7 | °C/W | SOT23-3 | 4 | ||
| Junction-to-Board Thermal Resistance | RθJB | 22.9 | °C/W | SOT23-3 | 4 | ||
| Junction-to-Top Characterization Parameter | ψJT | 4.2 | °C/W | SOT23-3 | 4 | ||
| Junction-to-Board Characterization Parameter | ψJB | 26.7 | °C/W | SOT23-3 | 4 | ||
| Junction-to-Case (Top) Thermal Resistance | RθJC(top) | 84.9 | °C/W | SOT23-3 | 4 |
CAD (KiCad official)
- Symbol:
REF318SOT233 - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
ref318sot233-etched.step/ref318sot233-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ref318sot233.step/ref318sot233.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: analogysemi datasheet (17 pp, sha256
1bd116cea5a7950d, retrieved 2026-10-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# REF318SOT233
**analogysemi** · Voltage Reference · SOT-23-3
REF318SOT233 from analogysemi, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Supply input voltage; the datasheet recommends VOUT + 0.02 V up to 5.5 V, with an absolute maximum input of 6.5 V, and the device powers up once VIN exceeds VOUT. |
| 2 | OUT | power_out | Reference voltage output that sources or sinks up to ±25 mA over the stated operating conditions, with a 0.1 µF to 10 µF ceramic capacitor recommended for bypass. |
| 3 | GND | power_in | Ground reference pin for the device. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | analogysemi |
| Package | SOT-23-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Initial Accuracy | | -0.1 | 0.05 | 0.1 | % | | 5 |
| Line Regulation | | -180 | 3 | 180 | µV/V | VOUT + 0.05V ≤ VIN ≤ 5.5V | 5 |
| Line Regulation | | -230 | | 230 | µV/V | −40°C ≤ TA ≤ 125°C, VOUT + 0.05V ≤ VIN ≤ 5.5V | 5 |
| Output Voltage Temperature Drift | dVOUT/dT | | 5 | 20 | ppm/°C | −40°C ≤ TA ≤ 125°C | 6 |
| Load Regulation (sourcing) | dVOUT/dLOAD | -30 | -2 | 30 | ppm/mA | Sourcing, 0mA < ILOAD < 25mA, VIN = VOUT + 250mV | 6 |
| Load Regulation (sourcing, temperature) | dVOUT/dLOAD | -30 | | 30 | ppm/mA | −40°C ≤ TA ≤ 125°C, sourcing, 0mA < ILOAD < 10mA, VIN = VOUT + 250mV | 6 |
| Load Regulation (sinking) | dVOUT/dLOAD | -100 | -57 | 100 | ppm/mA | Sinking, −10mA < ILOAD < 0mA, VIN = VOUT + 100mV | 6 |
| Load Regulation (sinking, temperature) | dVOUT/dLOAD | -150 | | 150 | ppm/mA | −40°C ≤ TA ≤ 125°C, sinking, −10mA < ILOAD < 0mA, VIN = VOUT + 100mV | 6 |
| Thermal Hysteresis | dT | -300 | | 300 | ppm | First Cycle | 6 |
| Thermal Hysteresis | dT | -60 | | 60 | ppm | Additional Cycles | 6 |
| Dropout Voltage | | | 5 | 10 | mV | ILOAD = 50µA, output ≤ 2.048V | 6 |
| Output Current | ILOAD | -25 | | 25 | mA | output > 2.048V, VIN = VOUT + 250mV; output ≤ 2.048V, VIN = VOUT + 400mV | 6 |
| Input Voltage | VIN | | | 5.5 | V | Voltage VIN; minimum printed as VOUT + 0.002 (expression, not numeric) | 7 |
| Quiescent Current | IQ | | 60 | 80 | µA | IL = 0 | 7 |
| Temperature Range, Specified | | -40 | | 125 | °C | | 7 |
| Temperature Range, Operating | TA | -55 | | 135 | °C | | 7 |
| Temperature Range, Storage | | -65 | | 150 | °C | | 7 |
| Supply Input Voltage | VIN | | | 5.5 | V | Minimum printed as VOUT + 0.02 (expression, not numeric) | 4 |
| Output Current Range | IOUT | -25 | | 25 | mA | | 4 |
| Operating Temperature | TA | -55 | | 135 | °C | | 4 |
| Input Voltage (absolute maximum) | VIN | | | 6.5 | V | | 3 |
| Output Voltage (absolute maximum) | VOUT | | | 5 | V | | 3 |
| Operating Temperature (absolute maximum) | TA | -55 | | 150 | °C | | 3 |
| Junction Temperature (absolute maximum) | TJ | | | 150 | °C | | 3 |
| ESD Human-Body Model | V(ESD) | -8000 | | 8000 | V | HBM, per ANSI/ESDA/JEDEC JS-001 | 3 |
| ESD Charged-Device Model | V(ESD) | -2000 | | 2000 | V | CDM, per JEDEC JESD22-C101 | 3 |
| Junction-to-Ambient Thermal Resistance | RθJA | | 176.7 | | °C/W | SOT23-3 | 4 |
| Junction-to-Board Thermal Resistance | RθJB | | 22.9 | | °C/W | SOT23-3 | 4 |
| Junction-to-Top Characterization Parameter | ψJT | | 4.2 | | °C/W | SOT23-3 | 4 |
| Junction-to-Board Characterization Parameter | ψJB | | 26.7 | | °C/W | SOT23-3 | 4 |
| Junction-to-Case (Top) Thermal Resistance | RθJC(top) | | 84.9 | | °C/W | SOT23-3 | 4 |
## CAD (KiCad official)
- Symbol: `REF318SOT233`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files: `ref318sot233-etched.step` / `ref318sot233-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ref318sot233.step` / `ref318sot233.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [analogysemi datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8602919078134755328) (17 pp, sha256 `1bd116cea5a7950d`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ref318sot233-datasheet.pdf)