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REF3030EAIDBZR

Public Made by Adom

by adom

Texas Instruments , SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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REF3030EAIDBZR

Texas Instruments · IC · SOT-23-3

REF3030EAIDBZR from Texas Instruments, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Input supply voltage, recommended 5.75V max for REF30xxE (absolute maximum 6V) and at least VOUT + 0.2V at load.
2 OUT power_out Reference output voltage (3V for REF3030E), with load current of ±10mA for REF30xxE.
3 GND power_in Ground.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-3
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output Voltage VOUT 2.997 3 3.003 V REF3030E, TA=25°C, VIN=VOUT+300mV, CIN=0.1µF, COUT=1µF, ILOAD=0mA 6
Initial accuracy -0.1 0.1 % REF3030E, TA=25°C 6
Line regulation 16 240 µV/V VOUT+300mV ≤ VIN ≤ 5.75V 6
Output voltage noise 0.1Hz to 10Hz 24 µVPP ƒ = 0.1Hz to 10Hz 6
Output voltage noise 10Hz to 10kHz 51 µVrms ƒ = 10Hz to 10kHz 6
Supply voltage, IN to GND (REF30xxE) 6 V REF30xxE 4
Output short-circuit current 70 mA Short circuit to ground 4
Operating temperature (abs max) -40 125 °C 4
Junction temperature TJ max 150 °C 4
Storage temperature range Tstg -65 150 °C 4
ESD HBM V(ESD) -2000 2000 V REF30E, HBM per ANSI/ESDA/JEDEC JS-001, all pins 4
ESD CDM V(ESD) -500 500 V REF30E, CDM per JESD22-C101, all pins 4
Input voltage VIN 5.75 V REF30xxE; min is VOUT + 0.2 4
Load current ILOAD -10 10 mA REF30xxE 4
Operating temperature TA -40 125 °C 4
Junction-to-ambient thermal resistance RθJA 218.5 °C/W REF30XXE, DBZ (SOT-23) 3 pins 5
Junction-to-case (top) thermal resistance RθJC(top) 120.6 °C/W REF30XXE, DBZ 5
Junction-to-board thermal resistance RθJB 48.7 °C/W REF30XXE, DBZ 5
Junction-to-top characterization parameter ΨJT 14.5 °C/W REF30XXE, DBZ 5
Junction-to-board characterization parameter ΨJB 48.2 °C/W REF30XXE, DBZ 5

CAD (KiCad official)

  • Symbol: REF3030EAIDBZR
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: ref3030eaidbzr-etched.step / ref3030eaidbzr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ref3030eaidbzr.step / ref3030eaidbzr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (37 pp, sha256 59daf1014acc7ddf, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF