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REF2925AIDBZT

Texas Instruments · Voltage Reference · SOT-23-3

REF2925AIDBZT from Texas Instruments, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Input supply voltage; VIN must be at least VREF + 0.05 V and no more than 5.5 V per the recommended operating conditions.
2 OUT output Reference output voltage, which is 2.5 V for the REF2925 per the device comparison table; the device does not require a load capacitor but is stable with any capacitive load.
3 GND power_in Ground reference pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage VOUT 2.45 2.5 2.55 V 5
Initial accuracy -2 2 % 5
Line regulation 120 325 µV/V VREF + 50 mV ≤ VIN ≤ 5.5 V 5
Output voltage temperature drift dVOUT/dT 35 100 ppm/°C –40°C ≤ TA ≤ 125°C 5
Load regulation dVOUT/dILOAD 3 100 µV/mA 0 mA < ILOAD < 25 mA, VIN = VREF + 500 mV 5
Long-term stability 0 to 1000 H 24 ppm 0 to 1000H 5
Long-term stability 1000 to 2000 H 15 ppm 1000 to 2000H 5
Thermal hysteresis dT 25 100 ppm 6
Dropout voltage VIN – VOUT 1 50 mV 6
Supply voltage (IL = 0) VS 5.5 V IL = 0 6
Supply voltage over temperature VS 5.5 V –40°C ≤ TA ≤ 125°C 6
Quiescent current IQ 42 50 µA 6
Quiescent current over temperature IQ 59 µA –40°C ≤ TA ≤ 125°C 6
Input voltage VIN 5.5 V 4
Load current ILOAD 25 mA 4
Operating temperature (recommended) TA -40 125 °C 4
Supply voltage V+ to V– 7 V 4
Operating temperature -40 125 °C 4
Junction temperature 150 °C 4
Storage temperature Tstg -65 150 °C 4
Lead temperature (soldering) 300 °C soldering, 10 s 4
Electrostatic discharge, human-body model V(ESD) -4000 4000 V HBM, per ANSI/ESDA/JEDEC JS-001 4
Electrostatic discharge, charged-device model V(ESD) -1500 1500 V CDM, per JEDEC JESD22-C101 4
Junction-to-ambient thermal resistance (DBZ SOT-23) RθJA 297.3 °C/W DBZ (SOT-23), 3 pins 4
Junction-to-case (top) thermal resistance RθJC(top) 128.5 °C/W DBZ (SOT-23), 3 pins 4
Junction-to-board thermal resistance RθJB 91.7 °C/W DBZ (SOT-23), 3 pins 4
Junction-to-top characterization parameter ψJT 12.8 °C/W DBZ (SOT-23), 3 pins 4
Junction-to-board characterization parameter ψJB 90.3 °C/W DBZ (SOT-23), 3 pins 4
Thermal resistance, junction-to-case (SOT-23) RθJC 110 °C/W SOT-23 surface-mount 6
Thermal resistance, junction-to-ambient (SOT-23) RθJA 336 °C/W 6

CAD (KiCad official)

  • Symbol: REF2925AIDBZT
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: ref2925aidbzt-etched.step / ref2925aidbzt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ref2925aidbzt.step / ref2925aidbzt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (27 pp, sha256 8ea634de078f1bc7, retrieved 2026-10-12, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF