component
REF198ESZ-REEL
Public Made by Adomby adom
Analog Devices Voltage Reference, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownREF198ESZ-REEL
Analog Devices · Voltage Reference · SOIC-8
REF198ESZ-REEL from Analog Devices, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TP | unconnected | Test pin reserved for in-package Zener zap trimming; the user should leave it unconnected. |
| 2 | VS | power_in | Supply input; the reference regulates from supplies as low as 100 mV above the output voltage. |
| 3 | SLEEP | input | Sleep control; a low TTL or CMOS level turns the output off and reduces supply current to less than 15 μA. |
| 4 | GND | power_in | Ground reference for the device. |
| 5 | TP | unconnected | Test pin reserved for in-package Zener zap trimming; the user should leave it unconnected. |
| 6 | OUTPUT | power_out | Precision voltage reference output; for REF198 the nominal output is 4.096 V. |
| 7 | NC | unconnected | No connect. |
| 8 | NC | unconnected | No connect. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Initial accuracy output voltage (E grade, 25°C) | VO | 4.094 | 4.096 | 4.098 | V | IOUT = 0 mA | 14 |
| Line regulation (E grade, 25°C) | ΔVO/ΔVIN | 2 | 4 | ppm/V | 4.5 V ≤ VS ≤ 15 V, IOUT = 0 mA | 14 | |
| Load regulation (E grade, 25°C) | ΔVO/ΔVLOAD | 2 | 4 | ppm/mA | VS = 5.4 V, 0 mA ≤ IOUT ≤ 30 mA | 14 | |
| Dropout voltage (25°C) | VS − VO | 0.502 | V | VS = 4.6 V, ILOAD = 10 mA | 14 | ||
| Dropout voltage (25°C) | VS − VO | 1.3 | V | VS = 5.4 V, ILOAD = 30 mA | 14 | ||
| Long-term stability | DVO | 1.2 | mV | 1000 hours @ 125°C | 14 | ||
| Noise voltage | eN | 40 | μV p-p | 0.1 Hz to 10 Hz | 14 | ||
| Temperature coefficient (E grade, −40°C to +85°C) | TCVO | 2 | 5 | ppm/°C | IOUT = 0 mA | 14 | |
| Line regulation (E grade, −40°C to +85°C) | ΔVO/ΔVIN | 5 | 10 | ppm/V | 4.5 V ≤ VS ≤ 15 V, IOUT = 0 mA | 14 | |
| Load regulation (E grade, −40°C to +85°C) | ΔVO/ΔVLOAD | 5 | 10 | ppm/mA | VS = 5.4 V, 0 mA ≤ IOUT ≤ 25 mA | 14 | |
| Dropout voltage (−40°C to +85°C) | VS − VO | 0.502 | V | VS = 4.6 V, ILOAD = 10 mA | 14 | ||
| Dropout voltage (−40°C to +85°C) | VS − VO | 1.3 | V | VS = 5.4 V, ILOAD = 25 mA | 14 | ||
| Sleep pin logic high input voltage | VH | 2.4 | V | 14 | |||
| Sleep pin logic low input voltage | VL | 0.8 | V | 14 | |||
| Sleep pin logic high input current | IH | -8 | μA | 14 | |||
| Sleep pin logic low input current | IL | -8 | μA | 14 | |||
| Supply current | 45 | μA | No load | 14 | |||
| Sleep mode supply current | 15 | μA | No load | 14 | |||
| Temperature coefficient (E grade, −40°C to +125°C) | TCVO | 2 | ppm/°C | IOUT = 0 mA | 15 | ||
| Line regulation (E grade, −40°C to +125°C) | ΔVO/ΔVIN | 5 | ppm/V | 4.5 V ≤ VS ≤ 15 V, IOUT = 0 mA | 15 | ||
| Load regulation (E grade, −40°C to +125°C) | ΔVO/ΔVLOAD | 5 | ppm/mA | VS = 5.6 V, 0 mA ≤ IOUT ≤ 20 mA | 15 | ||
| Dropout voltage (−40°C to +125°C) | VS − VO | 0.6 | V | VS = 4.7 V, ILOAD = 10 mA | 15 | ||
| Dropout voltage (−40°C to +125°C) | VS − VO | 1.5 | V | VS = 5.6 V, ILOAD = 20 mA | 15 | ||
| Supply voltage | -0.3 | 18 | V | 16 | |||
| Output to GND | -0.3 | V | Maximum printed as VS + 0.3 V | 16 | |||
| Storage temperature range | -65 | 150 | °C | PDIP, SOIC package | 16 | ||
| Operating temperature range | -40 | 125 | °C | REF19x | 16 | ||
| Junction temperature range | -65 | 150 | °C | PDIP, SOIC package | 16 | ||
| Lead temperature (soldering) | 300 | °C | Soldering 60 sec | 16 | |||
| Thermal resistance junction-to-ambient | θJA | 158 | °C/W | 8-Lead SOIC (R), device soldered in circuit board (worst-case) | 16 | ||
| Thermal resistance junction-to-case | θJC | 43 | °C/W | 8-Lead SOIC (R) | 16 |
CAD (KiCad official)
- Symbol:
REF198ESZ-REEL - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ref198esz-reel-etched.step/ref198esz-reel-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ref198esz-reel.step/ref198esz-reel.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Analog Devices datasheet (28 pp, sha256
ef0274c459ea0acb, retrieved 2026-10-09, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).