component
RB551V-40 RQG
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Taiwan Semiconductor Schottky Diodes, SOD-323. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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RB551V-40 RQG
Taiwan Semiconductor · Schottky Diodes · SOD-323
RB551V-40 RQG from Taiwan Semiconductor, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | V(BR) | 40 | V | IR=0.1mA | 1 | ||
| Reverse Leakage Current | IR | 0.1 | mA | VR=40V | 1 | ||
| Forward Voltage | VF | 0.47 | V | IF=500mA | 1 | ||
| Non-Repetitive Peak Reverse Voltage | VRM | 40 | V | 1 | |||
| Continuous Forward Current | Io | 500 | mA | 1 | |||
| Forward Peak Surge Current | IFSM | 2 | A | t=8.3ms | 1 | ||
| Power Dissipation | PD | 200 | mW | 1 | |||
| Thermal Resistance from Junction to Ambient | RθJA | 500 | °C/W | 1 | |||
| Junction Temperature | TJ | 125 | °C | 1 | |||
| Storage Temperature | TSTG | -55 | 150 | °C | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | - Case: Bend lead SOD-323 small outline plastic package - Terminal: Matte tin plated, lead free, solderable | 1 |
CAD (KiCad official)
- Symbol:
RB551V-40 RQG - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
rb551v-40-rqg-etched.step/rb551v-40-rqg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);rb551v-40-rqg.step/rb551v-40-rqg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Taiwan Semiconductor datasheet (4 pp, sha256
5efbd76ef5181188, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# RB551V-40 RQG
**Taiwan Semiconductor** · Schottky Diodes · SOD-323
RB551V-40 RQG from Taiwan Semiconductor, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Taiwan Semiconductor |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage | V(BR) | 40 | | | V | IR=0.1mA | 1 |
| Reverse Leakage Current | IR | | | 0.1 | mA | VR=40V | 1 |
| Forward Voltage | VF | | | 0.47 | V | IF=500mA | 1 |
| Non-Repetitive Peak Reverse Voltage | VRM | | | 40 | V | | 1 |
| Continuous Forward Current | Io | | | 500 | mA | | 1 |
| Forward Peak Surge Current | IFSM | | | 2 | A | t=8.3ms | 1 |
| Power Dissipation | PD | | | 200 | mW | | 1 |
| Thermal Resistance from Junction to Ambient | RθJA | | | 500 | °C/W | | 1 |
| Junction Temperature | TJ | | | 125 | °C | | 1 |
| Storage Temperature | TSTG | -55 | | 150 | °C | | 1 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | - Case: Bend lead SOD-323 small outline plastic package - Terminal: Matte tin plated, lead free, solderable | 1 |
## CAD (KiCad official)
- Symbol: `RB551V-40 RQG`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `rb551v-40-rqg-etched.step` / `rb551v-40-rqg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `rb551v-40-rqg.step` / `rb551v-40-rqg.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Taiwan Semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588904618822938624) (4 pp, sha256 `5efbd76ef5181188`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/rb551v-40-rqg-datasheet.pdf)