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Contents

Pinout
Key specifications
Electrical characteristics
CAD (KiCad official)
Provenance

README

markdown

RB521S30

Nexperia · Schottky Barrier Diodes (SBD) · SOD-523

RB521S30 from Nexperia, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	K	passive	Cathode; the marking bar on the package indicates the cathode.
2	A	passive	Anode; the pinning table gives no further electrical limits or function for this pin.

Key specifications

Parameter	Value
Manufacturer	Nexperia
Package	SOD-523
Category	Diodes
Pins	2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Forward voltage at IF = 0.1 mA	VF		130	190	mV	IF = 0.1 mA; pulsed test tp ≤ 300 μs; δ ≤ 0.02	4
Forward voltage at IF = 1 mA	VF		190	250	mV	IF = 1 mA; pulsed test tp ≤ 300 μs; δ ≤ 0.02	4
Forward voltage at IF = 10 mA	VF		255	300	mV	IF = 10 mA; pulsed test tp ≤ 300 μs; δ ≤ 0.02	4
Forward voltage at IF = 100 mA	VF		355	410	mV	IF = 100 mA; pulsed test tp ≤ 300 μs; δ ≤ 0.02	4
Forward voltage at IF = 200 mA	VF		420	500	mV	IF = 200 mA; pulsed test tp ≤ 300 μs; δ ≤ 0.02	4
Reverse current	IR		2.5	30	µA	VR = 10 V	4
Diode capacitance	Cd		20	25	pF	VR = 1 V; f = 1 MHz	4
Reverse voltage	VR			30	V	Tj = 25 °C	2
Average forward current	IF(AV)			0.2	A	δ = 0.5; f = 20 kHz; Tamb ≤ 120 °C; square wave; FR4 PCB, cathode pad 1 cm²	2
Non-repetitive peak forward current	IFSM			1	A	tp = 8.3 ms; half sine wave; JEDEC method; Tj(init) = 25 °C prior to surge	2
Total power dissipation	Ptot			275	mW	Tamb ≤ 25 °C; FR4 PCB, single-sided copper, standard footprint	2
Total power dissipation	Ptot			420	mW	Tamb ≤ 25 °C; FR4 PCB, single-sided copper, mounting pad for cathode 1 cm²	2
Total power dissipation	Ptot			500	mW	Tamb ≤ 25 °C; ceramic PCB, Al2O3, standard footprint	2
Junction temperature	Tj			150	°C		2
Ambient temperature	Tamb	-55		150	°C		2
Storage temperature	Tstg	-65		150	°C		2
Thermal resistance from junction to ambient	Rth(j-a)			455	K/W	In free air; FR4 PCB, single-sided copper, standard footprint; reflow soldering	2
Thermal resistance from junction to ambient	Rth(j-a)			300	K/W	In free air; FR4 PCB, mounting pad for cathode 1 cm²; reflow soldering	2
Thermal resistance from junction to ambient	Rth(j-a)			250	K/W	In free air; ceramic PCB, Al2O3, standard footprint; reflow soldering	2
Thermal resistance from junction to solder point	Rth(j-sp)			90	K/W	Soldering point of cathode tab	3

CAD (KiCad official)

Symbol: RB521S30
Footprint: Diode_SMD:D_SOD-523
3D model: SOD-523 (KiCad packages3D, STEP)
3D model files: rb521s30-etched.step / rb521s30-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rb521s30.step / rb521s30.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Nexperia datasheet (11 pp, sha256 347010abe091d1b2, retrieved 2026-10-21, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF