component

RB520S30

Public Made by Adom

by adom

Nexperia Schottky Barrier Diodes (SBD), SOD-523. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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RB520S30

Nexperia · Schottky Barrier Diodes (SBD) · SOD-523

RB520S30 from Nexperia, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Schottky barrier rectifier.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-523
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
reverse voltage VR 30 V Tj = 25 °C 2
average forward current IF(AV) 200 mA δ = 0.5; f = 20 kHz; Tamb ≤ 105 °C; square wave 2
non-repetitive peak forward current IFSM 1 A tp = 8.3 ms; half sine wave; Tj(init) = 25 °C 2
total power dissipation (footnote [2], standard footprint) Ptot 275 mW Tamb ≤ 25 °C 2
total power dissipation (footnote [1], cathode pad 1 cm2) Ptot 420 mW Tamb ≤ 25 °C 2
total power dissipation (footnote [3], ceramic PCB) Ptot 500 mW Tamb ≤ 25 °C 2
junction temperature Tj 150 °C 2
ambient temperature Tamb -55 150 °C 2
storage temperature Tstg -65 150 °C 2
forward voltage VF 190 220 mV IF = 0.1 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 250 290 mV IF = 1 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 320 360 mV IF = 10 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 440 500 mV IF = 100 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 520 600 mV IF = 200 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
reverse current IR 1 µA VR = 10 V; Tj = 25 °C 4
diode capacitance Cd 20 pF VR = 1 V; f = 1 MHz; Tj = 25 °C 4
thermal resistance from junction to ambient (standard footprint) Rth(j-a) 455 K/W FR4 PCB, standard footprint; in free air 3
thermal resistance from junction to ambient (cathode pad 1 cm2) Rth(j-a) 300 K/W FR4 PCB, mounting pad for cathode 1 cm2; in free air 3
thermal resistance from junction to ambient (ceramic PCB) Rth(j-a) 250 K/W ceramic PCB, Al2O3, standard footprint; in free air 3
thermal resistance from junction to solder point Rth(j-sp) 90 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: RB520S30
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523 (KiCad packages3D, STEP)
  • 3D model files: rb520s30-etched.step / rb520s30-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); rb520s30.step / rb520s30.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (11 pp, sha256 8a9db63d52b360cb, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF