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QX2304L30E

Public Made by Adom

by adom

QX Micro Devices DC-DC Converters, SOT-89. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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QX2304L30E

QX Micro Devices · DC-DC Converters · SOT-89

QX2304L30E from QX Micro Devices, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin of the device.
2 VOUT input Output voltage feedback/sense pin; absolute maximum voltage on VOUT is 7 V.
3 LX output Drain of the internal power switch; absolute maximum voltage 7 V and maximum current 1000 mA.

Key specifications

Parameter Value
Manufacturer QX Micro Devices
Package SOT-89
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage accuracy ΔVOUT -2.5 2.5 % VIN =2V, ILOAD =10mA 6
Current limit ILIMIT 600 800 1000 mA 6
Start-up voltage VSTART 0.8 V ILOAD =1mA, VIN rising from 0V to 2V 6
Standby input current IINQ 1 uA No load, EN low 6
Efficiency η 90 95 % 6
Hold voltage VHOLD 0.6 V ILOAD =1mA, VIN falling from 2V to 0V 6
No-load input current IIN0 15 uA VIN =1.8V, VOUT =3.3V 6
VOUT input current IOUT0 6 uA VOUT pin driven to normal VOUT +0.5V 6
Maximum oscillation frequency FMAX 300 KHz 6
Oscillator duty cycle DCOSC 83 % 6
Maximum voltage on VOUT and LX VMAX 7 V 5
Maximum LX current ILX_MAX 1000 mA 5
SOT89-3 maximum power dissipation PSOT89-3 0.5 W 5
Operating temperature range TA -20 85 °C 5
Storage temperature range TSTG -40 120 °C 5
Soldering temperature SOT23/SOT23-5/SOT89-3 TSD1 230 240 °C Time less than 30 seconds 5
ESD HBM VHBM 2000 V HBM 5

CAD (KiCad official)

  • Symbol: QX2304L30E
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: qx2304l30e-etched.step / qx2304l30e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); qx2304l30e.step / qx2304l30e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: QX Micro Devices datasheet (14 pp, sha256 d147751aef814a16, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF