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PZU24BA-QX

NEXPERIA USA INC. · Global Sourcing Parts · SOD-323

PZU24BA-QX from NEXPERIA USA INC., in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 cathode passive Cathode (K) of the Zener diode, identified by the marking bar on the package; the datasheet gives no further electrical limits for this pin.
2 anode passive Anode (A) of the Zener diode, the terminal opposite the cathode; the datasheet gives no further electrical limits for this pin.

Key specifications

Parameter Value
Manufacturer NEXPERIA USA INC.
Package SOD-323
Category Global Sourcing Parts
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (nominal 24 V, tolerance series B) VZ 22.93 25.57 V IZ = 5 mA; Tj = 25 °C 6
Maximum differential resistance rdif 120 Ω IZ = 5 mA 6
Maximum differential resistance rdif 30 Ω IZ = 0.5 mA 6
Reverse current IR 50 nA VR = 19 V (per table row) 6
Diode capacitance Cd 80 pF f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 1.3 A tp = 100 µs; square wave; Tj = 25 °C prior to surge 6
Forward voltage VF 0.9 V IF = 10 mA; Tamb = 25 °C; pulse test tp ≤ 300 µs; δ ≤ 0.02 3
Forward voltage VF 1.1 V IF = 100 mA; Tamb = 25 °C; pulse test tp ≤ 300 µs; δ ≤ 0.02 3
Forward current IF 200 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tj = 25 °C prior to surge 3
Total power dissipation Ptot 320 mW Tamb ≤ 25 °C; device on FR4 PCB, single-sided copper, standard footprint 3
Total power dissipation Ptot 490 mW FR4 PCB, single-sided copper, mounting pad for cathode 1 cm² 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance from junction to ambient Rth(j-a) 390 K/W in free air; FR4 PCB, single-sided copper, standard footprint 3
Thermal resistance from junction to ambient Rth(j-a) 255 K/W FR4 PCB, single-sided copper, mounting pad for cathode 1 cm² 3
Thermal resistance from junction to solder point Rth(j-sp) 55 K/W soldering point of cathode tab 3
Temperature coefficient SZ 20.4 mV/K IZ = 5 mA; Tj = 25 °C 6

CAD (KiCad official)

  • Symbol: PZU24BA-QX
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: pzu24ba-qx-etched.step / pzu24ba-qx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pzu24ba-qx.step / pzu24ba-qx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: NEXPERIA USA INC. datasheet (12 pp, sha256 389b87cd7a1bba24, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF