Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

PNE20030EPX

Nexperia · Diodes - Fast Recovery Rectifiers · SOD-128

PNE20030EPX from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the rectifier (reverse voltage VR up to 200 V); the cathode tab is the solder point referenced for Rth(j-sp).
2 A passive Anode of the rectifier, with forward current IF up to 4.2 A and average forward current IF(AV) up to 3 A.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-128
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Repetitive peak reverse voltage VRRM 200 V 3
Reverse voltage VR 200 V 3
RMS voltage VRMS 140 V Tj = 25 °C 3
Forward current IF 4.2 A δ = 1; Tsp ≤ 150 °C 3
Average forward current IF(AV) 3 A δ = 0.5; f = 20 kHz; square wave; Tsp ≤ 155 °C 3
Non-repetitive peak forward current IFSM 75 A tp = 8.3 ms; single half sine wave (applied at rated load condition); Tj(init) = 25 °C 3
Total power dissipation Ptot 0.81 W Tamb ≤ 25 °C; FR4 PCB, standard footprint 3
Total power dissipation Ptot 1.3 W Tamb ≤ 25 °C; FR4 PCB, mounting pad for cathode 1 cm2 3
Junction temperature Tj 175 °C 3
Ambient temperature Tamb -55 175 °C 3
Storage temperature Tstg -65 175 °C 3
Thermal resistance junction to ambient Rth(j-a) 185 K/W in free air; FR4 PCB, standard footprint 3
Thermal resistance junction to ambient Rth(j-a) 115 K/W in free air; FR4 PCB, mounting pad for cathode 1 cm2 3
Thermal resistance junction to solder point Rth(j-sp) 8 K/W soldering point of cathode tab 3
Reverse breakdown voltage V(BR)R 200 V IR = 100 µA; Tj = 25 °C 5
Forward voltage VF 875 980 mV IF = 3 A; Tj = 25 °C 5
Forward voltage VF 730 820 mV IF = 3 A; Tj = 125 °C 5
Reverse current IR 1 µA VR = 200 V; Tj = 25 °C 5
Reverse current IR 1.5 35 µA VR = 200 V; Tj = 125 °C 5
Reverse recovery time (step recovery) trr 13 30 ns IF = 0.5 A; IR = 1 A; IR(meas) = 0.25 A; Tj = 25 °C 5
Diode capacitance Cd 32 pF VR = 4 V; f = 1 MHz; Tj = 25 °C 5
Reverse recovery time (step recovery) trr 22 ns IF = 1 A; dIF/dt = 50 A/µs; VR = 30 V; Tj = 25 °C 5
Reverse recovery time (ramp recovery) trr 17 ns IF = 1 A; dIF/dt = 50 A/µs; VR = 30 V; Tj = 25 °C 5
Peak reverse recovery current IRM 1 A IF = 1 A; dIF/dt = 50 A/µs; VR = 30 V; Tj = 25 °C 5
Reverse recovery charge Qrr 16 nC IF = 1 A; dIF/dt = 100 A/µs; VR = 30 V; Tj = 25 °C 5
Peak forward recovery voltage VFRM 820 mV IF = 1 A; dIF/dt = 50 A/µs; Tj = 25 °C 5

CAD (KiCad official)

  • Symbol: PNE20030EPX
  • Footprint: Diode_SMD:D_SOD-128
  • 3D model: SOD-128 (KiCad packages3D, STEP)
  • 3D model files: pne20030epx-etched.step / pne20030epx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pne20030epx.step / pne20030epx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 de074c0129a5172d, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF