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PN8161SE-M1

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Wuxi Chipown Micro-electronics DC-DC Converters, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PN8161SE-M1

Wuxi Chipown Micro-electronics · DC-DC Converters · SOP-8

PN8161SE-M1 from Wuxi Chipown Micro-electronics, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; keep the trace from GND to the input electrolytic capacitor ground short and thick.
2 VDD power_in Operating supply input pin, 9-38V operating range with -0.3 to 40V absolute maximum, VDDon 16.5V typ, VDDoff 8.0V typ and VDD OVP 39.0V typ.
3 FB input Feedback input pin with -0.3 to 6.5V absolute maximum, open-circuit voltage 4.8V typ, and overload protection threshold 4.3V typ.
4 DMG input Demagnetization pin sampling output and input voltage via a resistor divider for valley detection, output OVP (3V typ threshold) and input undervoltage protection, rated -1 to 6.5V at IDMG≤10mA.
5 SW passive High-voltage MOSFET drain pin, rated -0.3 to 690V, shorted together with pins 6, 7 and 8.
6 SW passive High-voltage MOSFET drain pin, rated -0.3 to 690V, shorted together with pins 5, 7 and 8.
7 SW passive High-voltage MOSFET drain pin, rated -0.3 to 690V, shorted together with pins 5, 6 and 8.
8 SW passive High-voltage MOSFET drain pin, rated -0.3 to 690V, shorted together with pins 5, 6 and 7.

Key specifications

Parameter Value
Manufacturer Wuxi Chipown Micro-electronics
Package SOP-8
Category Power Management (PMIC)
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
功率管耐压 Drain-source breakdown voltage BVDSS 690 V ISW=250uA, TJ=25°C 3
关态漏电流 Off-state leakage current IOFF 10 25 40 μA Vsw=650V, TJ=25°C 3
VDD启动阈值电压 VDD turn-on threshold VDDon 15.5 16.5 17.5 V 3
VDD欠压保护阈值电压 VDD UVLO threshold VDDoff 7 8 9 V 3
VDD过压保护电压 VDD OVP voltage VDDovp 38 39 40 V 3
启动管充电电流 Startup charging current IVDD_CH -2 -1 -0.5 mA 3
开关态工作电流 Operating current switching IVDD0 1 2.5 4 mA VFB=3.5V 3
间歇态工作电流 Operating current burst IVDD1 0.4 0.8 1.5 mA VFB=0.5V 3
保护态工作电流 Fault state current IVDD_Fault 0.2 0.6 1.5 mA 3
FB开路电压 FB open-circuit voltage VFB 4.6 4.8 5.4 V 3
FB短路电流 FB short-circuit current IFB_SHORT 0.18 0.22 0.24 mA 3
过载保护阈值电压 Overload protection threshold Vth_OLP 4.1 4.3 4.5 V VDD=18V 3
最大峰值电流 Max peak current IDlim 1.05 1.1 1.15 A 3
输出过压保护阈值 Output OVP threshold VDMG_OVP 2.7 3 3.3 V VFB=2.0V 4
间歇态工作频率 Burst-mode frequency Fosc_BM 22 25 28 kHz 4
输入欠压保护阈值 Input undervoltage threshold current IDMG_BNO 180 200 220 uA 4
过温保护温度 Thermal shutdown temperature TSD 130 145 °C 4
导通电阻 On resistance RDS(on) 1.6 Ω ISW=1.0A, TJ=25°C 3
VDD BM保持阈值 VDD BM hold threshold Vhold 9 V 3
降频模式阈值电压 PFM threshold VFB_PFM 2.5 V VDMG≥1.4V 3
降频模式阈值电压 PFM threshold VFB_PFM 2 V VDMG<1.4V 3
间歇模式阈值电压 Burst mode threshold VFB_BM 1.15 V 3
间歇模式迟滞电压 Burst mode hysteresis VFB_BM_HYS 100 mV 3
软启动时间 Soft-start time Tss 7.5 ms 3
前沿消隐时间 Leading edge blanking time TLEB 400 ns 3
Burst-mode 峰值电流 IDbm 0.3 A 4
次级整流短路保护阈值 IDSP 2.2 A 4
次级整流短路保护延迟时间 Td_DSP 7 Cycles 4
输出过压保护延迟时间 Td_DOVP 7 Cycles 4
最大时钟开启等待时间 Thold 5 us 4
最大开启时间 Ton_max 25 us 4
最高工作频率 Fosc_QR 125 kHz 4
输入欠压保护延迟时间 Td_BNO 30 ms 4
过温保护回差 Thermal shutdown hysteresis THYST 20 °C 4
VDD脚耐压 VDD -0.3 40 V 3
FB脚耐压 FB -0.3 6.5 V 3
DMG脚耐压 DMG -1 6.5 V IDMG≤10mA 3
SW脚耐压 SW -0.3 690 V 3
结工作温度范围 Junction temperature TJ -40 150 °C 3
存储温度范围 Storage temperature Tstg -55 150 °C 3
人体模式ESD能力 HBM -2 2 kV HBM, ANSI/ESDA/JEDEC JS-001-2017 3
漏极脉冲电流 5 A Tpulse=100us 3
封装热阻 θJC θJC 40 °C/W SOP8 3

CAD (KiCad official)

  • Symbol: PN8161SE-M1
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: pn8161se-m1-etched.step / pn8161se-m1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pn8161se-m1.step / pn8161se-m1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Wuxi Chipown Micro-electronics datasheet (11 pp, sha256 de5d014f7bd3bab0, retrieved 2026-10-26, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF