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PMV230ENEAR

Nexperia · MOSFETs · SOT-23

PMV230ENEAR from Nexperia, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the MOSFET; gate-source voltage is limited to -20 V to 20 V (VGS, Tj = 25 °C).
2 S passive Source of the MOSFET; source current is limited to 0.8 A at Tamb = 25 °C (IS).
3 D passive Drain of the MOSFET; drain-source voltage is limited to 60 V and continuous drain current to 1.5 A at Tamb = 25 °C (VGS = 10 V).

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source voltage VDS 60 V 3
Gate-source voltage VGS -20 20 V Tj = 25 °C 3
Drain current ID 1.5 A VGS = 10 V; Tamb = 25 °C [1] 3
Drain current ID 0.9 A VGS = 10 V; Tamb = 100 °C [1] 3
Peak drain current IDM 5.9 A Tamb = 25 °C; single pulse; tp ≤ 10 µs 3
Non-repetitive drain-source avalanche energy EDS(AL)S 6 mJ Tj(init) = 25 °C; ID = 0.14 A; DUT in avalanche (unclamped) 3
Total power dissipation Ptot 480 mW Tamb = 25 °C [2] 3
Total power dissipation Ptot 950 mW Tamb = 25 °C [1] 3
Total power dissipation Ptot 1.45 W Tsp = 25 °C 3
Junction temperature Tj -55 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Source current IS 0.8 A Tamb = 25 °C [1] 3
Electrostatic discharge voltage VESD 2000 V HBM [3] 3
Thermal resistance from junction to ambient Rth(j-a) 227 261 K/W in free air [1] 5
Thermal resistance from junction to ambient Rth(j-a) 114 131 K/W in free air [2] 5
Thermal resistance from junction to solder point Rth(j-sp) 20 23 K/W 5
Drain-source breakdown voltage V(BR)DSS 60 V ID = 250 µA; VGS = 0 V; Tj = 25 °C 6
Gate-source threshold voltage VGSth 1.3 1.7 2.7 V ID = 250 µA; VDS=VGS; Tj = 25 °C 6
Drain leakage current IDSS 1 µA VDS = 60 V; VGS = 0 V; Tj = 25 °C 6
Gate leakage current IGSS 10 µA VGS = 20 V; VDS = 0 V; Tj = 25 °C 6
Gate leakage current IGSS -10 µA VGS = -20 V; VDS = 0 V; Tj = 25 °C 6
Gate leakage current IGSS 1 µA VGS = 10 V; VDS = 0 V; Tj = 25 °C 6
Gate leakage current IGSS -1 µA VGS = -10 V; VDS = 0 V; Tj = 25 °C 6
Drain-source on-state resistance RDSon 176 222 mΩ VGS = 10 V; ID = 1.5 A; Tj = 25 °C 6
Drain-source on-state resistance RDSon 332 441 mΩ VGS = 10 V; ID = 1.5 A; Tj = 150 °C 6
Drain-source on-state resistance RDSon 196 262 mΩ VGS = 4.5 V; ID = 1.4 A; Tj = 25 °C 6
Total gate charge QG(tot) 3.9 4.8 nC VDS = 30 V; ID = 1.5 A; VGS = 10 V; Tj = 25 °C 6
Source-drain voltage VSD 0.8 1.2 V IS = 0.8 A; VGS = 0 V; Tj = 25 °C 6

CAD (KiCad official)

  • Symbol: PMV230ENEAR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: pmv230enear-etched.step / pmv230enear-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmv230enear.step / pmv230enear.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (16 pp, sha256 b59743c9054b4f48, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF