# PMN30XPX

**Nexperia** · MOSFETs · TSOP-6

PMN30XPX from Nexperia, in a TSOP-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | D | passive | Drain of the P-channel MOSFET; drain pins 1, 2, 5 and 6 are all the drain terminal (Table 2). |
| 2 | D | passive | Drain of the P-channel MOSFET; drain pins 1, 2, 5 and 6 are all the drain terminal (Table 2). |
| 3 | G | input | Gate of the MOSFET; the gate-source voltage is limited to -12 V to 12 V (Table 5). |
| 4 | S | passive | Source of the P-channel MOSFET (Table 2). |
| 5 | D | passive | Drain of the P-channel MOSFET; drain pins 1, 2, 5 and 6 are all the drain terminal (Table 2). |
| 6 | D | passive | Drain of the P-channel MOSFET; drain pins 1, 2, 5 and 6 are all the drain terminal (Table 2). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | TSOP-6 |
| Category | Transistors/Thyristors |
| Pins | 6 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate-source threshold voltage | VGSth | -0.47 | -0.68 | -0.9 | V | ID = -250 µA; VDS=VGS; Tj = 25 °C | 7 |
| Drain-source on-state resistance | RDSon |  | 30 | 34 | mΩ | VGS = -4.5 V; ID = -5.2 A; Tj = 25 °C | 7 |
| Drain-source on-state resistance | RDSon |  | 46 | 52 | mΩ | VGS = -4.5 V; ID = -5.2 A; Tj = 150 °C | 7 |
| Drain-source on-state resistance | RDSon |  | 35 | 44 | mΩ | VGS = -2.5 V; ID = -4.6 A; Tj = 25 °C | 7 |
| Drain-source on-state resistance | RDSon |  | 45 | 65 | mΩ | VGS = -1.8 V; ID = -1 A; Tj = 25 °C | 7 |
| Drain-source on-state resistance | RDSon |  | 65 | 130 | mΩ | VGS = -1.5 V; ID = -0.1 A; Tj = 25 °C | 7 |
| Drain-source breakdown voltage | V(BR)DSS | -20 |  |  | V | ID = -250 µA; VGS = 0 V; Tj = 25 °C | 7 |
| Drain leakage current | IDSS |  |  | -1 | µA | VDS = -20 V; VGS = 0 V; Tj = 25 °C | 7 |
| Gate leakage current | IGSS |  |  | 100 | nA | VGS = 12 V; VDS = 0 V; Tj = 25 °C | 7 |
| Gate leakage current | IGSS |  |  | -100 | nA | VGS = -12 V; VDS = 0 V; Tj = 25 °C | 7 |
| Total gate charge | QG(tot) |  | 15 | 23 | nC | VDS = -10 V; ID = -5.5 A; VGS = -4.5 V; Tj = 25 °C | 7 |
| Source-drain voltage | VSD |  | -0.7 | -1.2 | V | IS = -1.3 A; VGS = 0 V; Tj = 25 °C | 7 |
| Drain-source voltage | VDS |  |  | -20 | V |  | 3 |
| Gate-source voltage | VGS | -12 |  | 12 | V | Tj = 25 °C | 3 |
| Drain current | ID |  |  | -6.8 | A | VGS = -4.5 V; Tamb = 25 °C; t ≤ 5 s | 3 |
| Drain current | ID |  |  | -5.2 | A | VGS = -4.5 V; Tamb = 25 °C | 3 |
| Drain current | ID |  |  | -3.3 | A | VGS = -4.5 V; Tamb = 100 °C | 3 |
| Peak drain current | IDM |  |  | -21 | A | Tamb = 25 °C; single pulse; tp ≤ 10 µs | 3 |
| Total power dissipation | Ptot |  |  | 550 | mW | Tamb = 25 °C; footnote [2]: FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 |
| Total power dissipation | Ptot |  |  | 1.4 | W | footnote [1]: FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2 | 3 |
| Total power dissipation | Ptot |  |  | 6.25 | W | Tsp = 25 °C | 3 |
| Junction temperature | Tj | -55 |  | 150 | °C |  | 3 |
| Ambient temperature | Tamb | -55 |  | 150 | °C |  | 3 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 3 |
| Source current | IS |  |  | -1.3 | A | Tamb = 25 °C; footnote [1]: FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2 | 3 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 195 | 225 | K/W | in free air; footnote [1]: FR4 PCB, single-sided copper, tin-plated, standard footprint | 5 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 78 | 90 | K/W | in free air; footnote [2]: FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2 | 5 |
| Thermal resistance from junction to ambient | Rth(j-a) |  | 45 | 52 | K/W | in free air; t ≤ 5 s; footnote [2]: FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2 | 5 |
| Thermal resistance from junction to solder point | Rth(j-sp) |  | 15 | 20 | K/W |  | 5 |

## CAD (KiCad official)

- Symbol: `PMN30XPX`
- Footprint: `Package_SO:TSOP-6_1.65x3.05mm_P0.95mm`
- 3D model: TSOP-6 (KiCad packages3D, STEP)
- 3D model files: `pmn30xpx-etched.step` / `pmn30xpx-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `pmn30xpx.step` / `pmn30xpx.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589838910060212224) (16 pp, sha256 `c995c7c568f234de`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/pmn30xpx-datasheet.pdf)