component

PMEG6030EVP-QX

Public Made by Adom

by adom

Nexperia Schottky Diodes, SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentdiodespmeg6030evp-qxfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
pmeg6030evp-qx / README.md
History Download
Ray Publish 0.1.0 8f89ea4 11d ago

PMEG6030EVP-QX

Nexperia · Schottky Diodes · SOD-128

PMEG6030EVP-QX from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky diode, identified by the marking bar on the package; the reverse voltage rating is VR ≤ 60 V at Tj = 25 °C.
2 A passive Anode of the Schottky diode; average forward current is limited to IF(AV) ≤ 3 A.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-128
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
reverse voltage VR 60 V Tj = 25 °C 2
forward current IF 4.2 A Tsp = 160 °C 2
average forward current IF(AV) 3 A δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 95 °C 2
non-repetitive peak forward current IFSM 70 A tp = 8.3 ms; half-sine wave; Tj(init) = 25 °C 2
total power dissipation Ptot 750 mW Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated and standard footprint 2
total power dissipation Ptot 1250 mW Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 2
total power dissipation Ptot 2500 mW Tamb ≤ 25 °C; ceramic PCB, Al2O3, standard footprint 2
junction temperature Tj 175 °C 2
ambient temperature Tamb -55 175 °C 2
storage temperature Tstg -65 175 °C 2
thermal resistance from junction to ambient Rth(j-a) 200 K/W in free air; FR4 PCB, single-sided copper, tin-plated and standard footprint 3
thermal resistance from junction to ambient Rth(j-a) 120 K/W in free air; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 3
thermal resistance from junction to ambient Rth(j-a) 60 K/W in free air; ceramic PCB, Al2O3, standard footprint 3
thermal resistance from junction to solder point Rth(j-sp) 12 K/W soldering point of cathode tab 3
forward voltage VF 275 310 mV IF = 0.1 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C; pulsed 4
forward voltage VF 355 400 mV IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C; pulsed 4
forward voltage VF 390 440 mV IF = 2 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C; pulsed 4
forward voltage VF 420 475 mV IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C; pulsed 4
reverse current IR 7 20 µA VR = 5 V; Tj = 25 °C; pulsed 4
reverse current IR 9 40 µA VR = 10 V; Tj = 25 °C; pulsed 4
reverse current IR 20 80 µA VR = 30 V; Tj = 25 °C; pulsed 4
reverse current IR 115 400 µA VR = 60 V; Tj = 25 °C; pulsed 4
reverse current IR 70 300 mA VR = 60 V; Tj = 125 °C; pulsed 4

CAD (KiCad official)

  • Symbol: PMEG6030EVP-QX
  • Footprint: Diode_SMD:D_SOD-128
  • 3D model: SOD-128 (KiCad packages3D, STEP)
  • 3D model files: pmeg6030evp-qx-etched.step / pmeg6030evp-qx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg6030evp-qx.step / pmeg6030evp-qx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 7f715247c94e7614, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF