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PMEG6030ELPX

Public Made by Adom

by adom

Nexperia Schottky Diodes, SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PMEG6030ELPX

Nexperia · Schottky Diodes · SOD-128

PMEG6030ELPX from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode terminal of the Schottky barrier rectifier, identified by the marking bar on the package (datasheet note 1).
2 A passive Anode terminal of the Schottky barrier rectifier.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-128
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
reverse voltage VR 60 V Tj = 25 °C 2
forward current IF 4.2 A δ = 1; Tsp = 150 °C 2
average forward current IF(AV) 3 A δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 75 °C 2
non-repetitive peak forward current IFSM 70 A tp = 8.3 ms; half sine wave; Tj(init) = 25 °C 2
total power dissipation Ptot 0.75 W Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated and standard footprint [2] 2
total power dissipation Ptot 1.25 W Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² [3] 2
total power dissipation Ptot 2.5 W Tamb ≤ 25 °C; ceramic PCB, Al2O3, standard footprint [1] 2
junction temperature Tj 175 °C 2
ambient temperature Tamb -55 175 °C 2
storage temperature Tstg -65 175 °C 2
thermal resistance from junction to ambient Rth(j-a) 200 K/W in free air; FR4 PCB, single-sided copper, tin-plated and standard footprint [2] 3
thermal resistance from junction to ambient Rth(j-a) 120 K/W in free air; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² [3] 3
thermal resistance from junction to ambient Rth(j-a) 60 K/W in free air; ceramic PCB, Al2O3, standard footprint [4] 3
thermal resistance from junction to solder point Rth(j-sp) 12 K/W soldering point of cathode tab [5] 3
reverse breakdown voltage V(BR)R 60 V IR = 1 mA; tp = 300 µs; δ = 0.02; Tj = 25 °C 4
forward voltage VF 440 500 mV IF = 0.1 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 495 555 mV IF = 0.5 A; tp ≤ 300 µs; δ = 0.02; Tj = 25 °C 4
forward voltage VF 505 565 mV IF = 0.7 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 525 585 mV IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 550 620 mV IF = 1.6 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 570 640 mV IF = 2 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 600 670 mV IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
forward voltage VF 510 630 mV IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 125 °C 4
reverse current IR 340 1000 nA VR = 60 V; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
reverse current IR 440 2100 µA VR = 60 V; tp ≤ 300 µs; δ ≤ 0.02; Tj = 125 °C 4

CAD (KiCad official)

  • Symbol: PMEG6030ELPX
  • Footprint: Diode_SMD:D_SOD-128
  • 3D model: SOD-128 (KiCad packages3D, STEP)
  • 3D model files: pmeg6030elpx-etched.step / pmeg6030elpx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg6030elpx.step / pmeg6030elpx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 dd33a3c394a4a353, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF