component
PMEG6020EP
Public Made by Adomby adom
Nexperia Schottky Barrier Diodes (SBD), SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPMEG6020EP
Nexperia · Schottky Barrier Diodes (SBD) · SOD-128
PMEG6020EP from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the Schottky diode (marking bar side, also the cathode tab used as heat-sinking solder point); reverse voltage VR ≤ 60 V. |
| 2 | A | passive | Anode of the Schottky diode; average forward current IF(AV) ≤ 2 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage | VR | 60 | V | Tj = 25 °C | 2 | ||
| Average forward current | IF(AV) | 2 | A | δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 85 °C; ceramic PCB Al2O3 | 2 | ||
| Non-repetitive peak forward current | IFSM | 50 | A | tp = 8.3 ms; half sine wave; Tj(init) = 25 °C | 2 | ||
| Total power dissipation (FR4, standard footprint) | Ptot | 625 | mW | Tamb ≤ 25 °C; FR4 PCB, standard footprint | 2 | ||
| Total power dissipation (FR4, 1 cm2 cathode pad) | Ptot | 1.05 | W | Tamb ≤ 25 °C; FR4 PCB, cathode pad 1 cm2 | 2 | ||
| Total power dissipation (ceramic PCB) | Ptot | 2.1 | W | Tamb ≤ 25 °C; ceramic PCB Al2O3, standard footprint | 2 | ||
| Junction temperature | Tj | 150 | °C | 2 | |||
| Ambient temperature | Tamb | -55 | 150 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 2 | ||
| Thermal resistance junction to ambient (FR4, standard footprint) | Rth(j-a) | 200 | K/W | in free air; FR4 PCB, standard footprint | 3 | ||
| Thermal resistance junction to ambient (FR4, 1 cm2 cathode pad) | Rth(j-a) | 120 | K/W | in free air; FR4 PCB, cathode pad 1 cm2 | 3 | ||
| Thermal resistance junction to ambient (ceramic PCB) | Rth(j-a) | 60 | K/W | in free air; ceramic PCB Al2O3, standard footprint | 3 | ||
| Thermal resistance junction to solder point | Rth(j-sp) | 12 | K/W | Soldering point of cathode tab | 3 | ||
| Forward voltage | VF | 300 | 340 | mV | IF = 0.1 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 360 | 420 | mV | IF = 0.5 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 400 | 460 | mV | IF = 1 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 430 | 500 | mV | IF = 1.5 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 460 | 530 | mV | IF = 2 A; Tj = 25 °C | 4 | |
| Reverse current | IR | 60 | 150 | µA | VR = 60 V; Tj = 25 °C | 4 | |
| Reverse current | IR | 2.5 | µA | VR = 5 V; Tj = 25 °C | 4 | ||
| Reverse current | IR | 3.5 | µA | VR = 10 V; Tj = 25 °C | 4 | ||
| Diode capacitance | Cd | 240 | pF | VR = 1 V; f = 1 MHz; Tj = 25 °C | 4 | ||
| Diode capacitance | Cd | 80 | pF | VR = 10 V; f = 1 MHz; Tj = 25 °C | 4 |
CAD (KiCad official)
- Symbol:
PMEG6020EP - Footprint:
Diode_SMD:D_SOD-128 - 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files:
pmeg6020ep-etched.step/pmeg6020ep-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pmeg6020ep.step/pmeg6020ep.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (12 pp, sha256
221126634d53ef32, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).