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PMEG6010CEGWX

Public Made by Adom

by adom

Nexperia Schottky Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PMEG6010CEGWX

Nexperia · Schottky Diodes · SOD-123

PMEG6010CEGWX from Nexperia, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky diode; the marking bar on the package indicates the cathode, and the reverse voltage VR is limited to 60 V (Table 5).
2 A passive Anode of the Schottky diode, opposite the cathode (pin 1) in the two-lead SOD123 package.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse voltage VR 60 V Tj = 25 °C 2
Forward current IF 1 A Tsp ≤ 55 °C 2
Average forward current IF(AV) 1 A δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 70 °C 2
Repetitive peak forward current IFRM 7 A tp ≤ 1 ms; δ ≤ 0.25 2
Non-repetitive peak forward current IFSM 9 A tp = 8 ms; square wave; Tj(init) = 25 °C 2
Total power dissipation Ptot 410 mW Tamb ≤ 25 °C 2
Total power dissipation Ptot 675 mW 2
Junction temperature Tj 150 °C 2
Ambient temperature Tamb -55 150 °C 2
Storage temperature Tstg -65 150 °C 2
Thermal resistance from junction to ambient in free air Rth(j-a) 305 K/W FR4 PCB, single-sided copper, tin-plated and standard footprint 3
Thermal resistance from junction to ambient in free air Rth(j-a) 185 K/W FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 3
Thermal resistance from junction to solder point Rth(j-sp) 21 K/W Soldering point of cathode tab 3
Reverse breakdown voltage V(BR)R 60 V IR = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 210 250 mV IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 270 310 mV IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 350 400 mV IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 460 530 mV IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 510 580 mV IF = 700 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 570 660 mV IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Reverse current IR 11 50 µA VR = 60 V; pulsed; Tj = 25 °C 4
Diode capacitance Cd 60 68 pF VR = 1 V; f = 1 MHz; Tj = 25 °C 4

CAD (KiCad official)

  • Symbol: PMEG6010CEGWX
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: pmeg6010cegwx-etched.step / pmeg6010cegwx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg6010cegwx.step / pmeg6010cegwx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (10 pp, sha256 f4cca1e46367f0f0, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF