component
PMEG4050ETP
Public Made by Adomby adom
Nexperia Schottky Diodes, SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPMEG4050ETP
Nexperia · Schottky Diodes · SOD-128
PMEG4050ETP from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, indicated by the marking bar on the package; the cathode tab is the solder point referenced for the junction-to-solder-point thermal resistance Rth(j-sp) of 12 K/W max. |
| 2 | A | passive | Anode of the Schottky barrier rectifier; the device is rated for reverse voltage VR ≤ 40 V and average forward current IF(AV) ≤ 5 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage | VR | 40 | V | Tj = 25 °C | 2 | ||
| Average forward current | IF(AV) | 5 | A | δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 15 °C; device mounted on a ceramic PCB, Al2O3, standard footprint [1] | 2 | ||
| Non-repetitive peak forward current | IFSM | 70 | A | tp = 8 ms; square wave; Tj(init) = 25 °C | 2 | ||
| Total power dissipation | Ptot | 750 | mW | Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint [2] | 2 | ||
| Total power dissipation | Ptot | 1.25 | W | Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 [3] | 2 | ||
| Total power dissipation | Ptot | 2.5 | W | Tamb ≤ 25 °C; device mounted on a ceramic PCB, Al2O3, standard footprint [1] | 2 | ||
| Junction temperature | Tj | 175 | °C | 2 | |||
| Ambient temperature | Tamb | -55 | 175 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 175 | °C | 2 | ||
| Forward voltage | VF | 270 | 310 | mV | IF = 0.1 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 340 | 390 | mV | IF = 1 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 430 | 490 | mV | IF = 5 A; Tj = 25 °C | 4 | |
| Reverse current | IR | 60 | 300 | µA | VR = 40 V; Tj = 25 °C | 4 | |
| Thermal resistance junction to ambient | Rth(j-a) | 200 | K/W | in free air; device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint [2] | 3 | ||
| Thermal resistance junction to ambient | Rth(j-a) | 120 | K/W | in free air; device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 [3] | 3 | ||
| Thermal resistance junction to ambient | Rth(j-a) | 60 | K/W | in free air; device mounted on a ceramic PCB, Al2O3, standard footprint [4] | 3 | ||
| Thermal resistance junction to solder point | Rth(j-sp) | 12 | K/W | soldering point of cathode tab [5] | 3 |
CAD (KiCad official)
- Symbol:
PMEG4050ETP - Footprint:
Diode_SMD:D_SOD-128 - 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files:
pmeg4050etp-etched.step/pmeg4050etp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pmeg4050etp.step/pmeg4050etp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (12 pp, sha256
2d39bd049b95d2bb, retrieved 2026-10-15, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).