component
PMEG4030EP
Public Made by Adomby adom
Nexperia Schottky Barrier Diodes (SBD), SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPMEG4030EP
Nexperia · Schottky Barrier Diodes (SBD) · SOD-128
PMEG4030EP from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode; the marking bar on the package indicates the cathode terminal. |
| 2 | A | passive | Anode terminal of the Schottky barrier rectifier; the datasheet gives no electrical limits specific to this pin beyond the device ratings (VR ≤ 40 V, IF(AV) ≤ 3 A). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage | VR | 40 | V | Tj = 25 °C | 2 | ||
| Average forward current | IF(AV) | 3 | A | δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 65 °C; device on ceramic PCB, Al2O3, standard footprint | 2 | ||
| Non-repetitive peak forward current | IFSM | 50 | A | tp = 8.3 ms; half sine wave; Tj(init) = 25 °C | 2 | ||
| Total power dissipation | Ptot | 625 | mW | Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, standard footprint (footnote [2]) | 2 | ||
| Total power dissipation | Ptot | 1.05 | W | Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² (footnote [3]) | 2 | ||
| Total power dissipation | Ptot | 2.1 | W | Tamb ≤ 25 °C; ceramic PCB, Al2O3, standard footprint (footnote [1]) | 2 | ||
| Junction temperature | Tj | 150 | °C | 2 | |||
| Ambient temperature | Tamb | -55 | 150 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 2 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 200 | K/W | in free air; FR4 PCB, single-sided copper, tin-plated, standard footprint (footnote [2]) | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 120 | K/W | in free air; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² (footnote [3]) | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 60 | K/W | in free air; ceramic PCB, Al2O3, standard footprint (footnote [4]) | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 12 | K/W | soldering point of cathode tab (footnote [5]) | 3 | ||
| Forward voltage | VF | 285 | 320 | mV | IF = 0.1 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 360 | 420 | mV | IF = 1 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 430 | 490 | mV | IF = 3 A; Tj = 25 °C | 4 | |
| Reverse current | IR | 35 | 200 | µA | VR = 40 V; Tj = 25 °C | 4 |
CAD (KiCad official)
- Symbol:
PMEG4030EP - Footprint:
Diode_SMD:D_SOD-128 - 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files:
pmeg4030ep-etched.step/pmeg4030ep-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pmeg4030ep.step/pmeg4030ep.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (12 pp, sha256
1c164093ee2f98d5, retrieved 2026-10-21, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).