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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206

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pmeg3050ep-etched.step	pmeg3050ep: factory component page (tier=mfr) · Ray	7d ago
pmeg3050ep-hero.glb	pmeg3050ep: hero GLB from the etched model (keeps the MPN mark) · Ray	7d ago
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PMEG3050EP

Nexperia · Schottky Barrier Diodes (SBD) · SOD-128

PMEG3050EP from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	K	passive	Cathode of the Schottky barrier rectifier; the marking bar on the package indicates the cathode.
2	A	passive	Anode of the Schottky barrier rectifier.

Key specifications

Parameter	Value
Manufacturer	Nexperia
Package	SOD-128
Category	Diodes
Pins	2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
reverse voltage	VR			30	V	Tj = 25 °C	2
average forward current	IF(AV)			5	A	δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 35 °C; device on ceramic PCB (footnote 1)	2
non-repetitive peak forward current	IFSM			70	A	tp = 8 ms; square wave; Tj(init) = 25 °C	2
total power dissipation	Ptot			0.625	W	Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, standard footprint (footnote 2)	2
total power dissipation	Ptot			1.05	W	Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² (footnote 3)	2
total power dissipation	Ptot			2.1	W	Tamb ≤ 25 °C; ceramic PCB, Al2O3, standard footprint (footnote 1)	2
junction temperature	Tj			150	°C		2
ambient temperature	Tamb	-55		150	°C		2
storage temperature	Tstg	-65		150	°C		2
thermal resistance from junction to ambient in free air	Rth(j-a)			200	K/W	FR4 PCB, single-sided copper, tin-plated, standard footprint (footnote 2)	3
thermal resistance from junction to ambient in free air	Rth(j-a)			120	K/W	FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² (footnote 3)	3
thermal resistance from junction to ambient in free air	Rth(j-a)			60	K/W	Ceramic PCB, Al2O3, standard footprint (footnote 4)	3
thermal resistance from junction to solder point	Rth(j-sp)			12	K/W	Soldering point of cathode tab (footnote 5)	3
forward voltage	VF		240	275	mV	IF = 1 A; Tj = 25 °C	4
forward voltage	VF		285	340	mV	IF = 3 A; Tj = 25 °C	4
forward voltage	VF		315	360	mV	IF = 5 A; Tj = 25 °C	4
reverse current	IR		2.6	8	mA	VR = 30 V; Tj = 25 °C	4

CAD (KiCad official)

Symbol: PMEG3050EP
Footprint: Diode_SMD:D_SOD-128
3D model: SOD-128 (KiCad packages3D, STEP)
3D model files: pmeg3050ep-etched.step / pmeg3050ep-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg3050ep.step / pmeg3050ep.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Nexperia datasheet (12 pp, sha256 35c7ba4dff4c4e4c, retrieved 2026-10-21, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF