component

PMEG3050BEP-QX

Public Made by Adom

by adom

Nexperia Schottky Diodes, SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PMEG3050BEP-QX

Nexperia · Schottky Diodes · SOD-128

PMEG3050BEP-QX from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky barrier rectifier; the marking bar on the package indicates the cathode.
2 A passive Anode of the Schottky barrier rectifier.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-128
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse voltage VR 30 V Tj = 25 °C 2
Average forward current IF(AV) 5 A δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 20 °C; [1] ceramic PCB, Al2O3, standard footprint 2
Non-repetitive peak forward current IFSM 70 A tp = 8.3 ms; half-sine wave; Tj(init) = 25 °C 2
Total power dissipation Ptot 625 mW Tamb ≤ 25 °C; [2] FR4 PCB, single-sided copper, tin-plated, standard footprint 2
Total power dissipation Ptot 1.05 W Tamb ≤ 25 °C; [3] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² 2
Total power dissipation Ptot 2.1 W Tamb ≤ 25 °C; [1] ceramic PCB, Al2O3, standard footprint 2
Junction temperature Tj 150 °C 2
Ambient temperature Tamb -55 150 °C 2
Storage temperature Tstg -65 150 °C 2
Forward voltage VF 270 300 mV IF = 0.1 A; Tj = 25 °C 4
Forward voltage VF 315 360 mV IF = 0.5 A; Tj = 25 °C 4
Forward voltage VF 335 380 mV IF = 1 A; Tj = 25 °C 4
Forward voltage VF 360 420 mV IF = 2 A; Tj = 25 °C 4
Forward voltage VF 380 440 mV IF = 3 A; Tj = 25 °C 4
Forward voltage VF 400 450 mV IF = 5 A; Tj = 25 °C 4
Reverse current IR 90 250 µA VR = 30 V; Tj = 25 °C 4
Thermal resistance from junction to ambient in free air Rth(j-a) 200 K/W in free air; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint 3
Thermal resistance from junction to ambient in free air Rth(j-a) 120 K/W in free air; [3] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² 3
Thermal resistance from junction to ambient in free air Rth(j-a) 60 K/W in free air; [4] ceramic PCB, Al2O3, standard footprint 3
Thermal resistance from junction to solder point Rth(j-sp) 12 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: PMEG3050BEP-QX
  • Footprint: Diode_SMD:D_SOD-128
  • 3D model: SOD-128 (KiCad packages3D, STEP)
  • 3D model files: pmeg3050bep-qx-etched.step / pmeg3050bep-qx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg3050bep-qx.step / pmeg3050bep-qx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 19bf7d5be5142c31, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF