Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

PMEG3050BEP

Nexperia · Schottky Barrier Diodes (SBD) · SOD-128

PMEG3050BEP from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky rectifier (marking bar side); the cathode tab is the solder point for Rth(j-sp) of 12 K/W max, and the diode is rated for VR up to 30 V.
2 A passive Anode of the Schottky rectifier, with average forward current IF(AV) up to 5 A and forward voltage of 450 mV max at IF = 5 A.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-128
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
reverse voltage VR 30 V Tj = 25 °C 2
average forward current IF(AV) 5 A δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 20 °C; ceramic PCB Al2O3, standard footprint 2
non-repetitive peak forward current IFSM 70 A tp = 8.3 ms; half sine wave; Tj(init) = 25 °C 2
total power dissipation (FR4, standard footprint) Ptot 625 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 2
total power dissipation (FR4, 1 cm2 cathode pad) Ptot 1.05 W Tamb ≤ 25 °C; FR4 PCB, cathode pad 1 cm2 2
total power dissipation (ceramic PCB) Ptot 2.1 W Tamb ≤ 25 °C; ceramic PCB Al2O3, standard footprint 2
junction temperature Tj 150 °C 2
ambient temperature Tamb -55 150 °C 2
storage temperature Tstg -65 150 °C 2
thermal resistance junction to ambient (FR4, standard footprint) Rth(j-a) 200 K/W in free air; FR4 PCB, standard footprint 3
thermal resistance junction to ambient (FR4, 1 cm2 cathode pad) Rth(j-a) 120 K/W in free air; FR4 PCB, cathode pad 1 cm2 3
thermal resistance junction to ambient (ceramic PCB) Rth(j-a) 60 K/W in free air; ceramic PCB Al2O3, standard footprint 3
thermal resistance junction to solder point Rth(j-sp) 12 K/W soldering point of cathode tab 3
forward voltage VF 270 300 mV IF = 0.1 A; Tj = 25 °C 4
forward voltage VF 315 360 mV IF = 0.5 A; Tj = 25 °C 4
forward voltage VF 335 380 mV IF = 1 A; Tj = 25 °C 4
forward voltage VF 360 420 mV IF = 2 A; Tj = 25 °C 4
forward voltage VF 380 440 mV IF = 3 A; Tj = 25 °C 4
forward voltage VF 400 450 mV IF = 5 A; Tj = 25 °C 4
reverse current IR 90 250 µA VR = 30 V; Tj = 25 °C 4
reverse current IR 10 µA VR = 5 V; Tj = 25 °C 4
reverse current IR 15 µA VR = 10 V; Tj = 25 °C 4
diode capacitance Cd 800 pF VR = 1 V; f = 1 MHz; Tj = 25 °C 4
diode capacitance Cd 275 pF VR = 10 V; f = 1 MHz; Tj = 25 °C 4

CAD (KiCad official)

  • Symbol: PMEG3050BEP
  • Footprint: Diode_SMD:D_SOD-128
  • 3D model: SOD-128 (KiCad packages3D, STEP)
  • 3D model files: pmeg3050bep-etched.step / pmeg3050bep-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg3050bep.step / pmeg3050bep.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 2753456fd78eb4e5, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF