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PMEG3030EP

Public Made by Adom

by adom

Nexperia Schottky Diodes, SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PMEG3030EP

Nexperia · Schottky Diodes · SOD-128

PMEG3030EP from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky barrier rectifier, indicated by the marking bar; the cathode tab is the soldering point for the 12 K/W junction-to-solder-point thermal resistance.
2 A passive Anode of the Schottky barrier rectifier; the datasheet gives no anode-specific limit, and the device is rated for VR ≤ 30 V and IF(AV) ≤ 3 A.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-128
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
reverse voltage VR 30 V Tj = 25 °C 2
average forward current IF(AV) 3 A δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 85 °C; ceramic PCB, Al2O3, standard footprint 2
non-repetitive peak forward current IFSM 50 A tp = 8 ms; square wave; Tj(init) = 25 °C 2
total power dissipation Ptot 0.625 W Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, standard footprint 2
total power dissipation Ptot 1.05 W Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 2
total power dissipation Ptot 2.1 W Tamb ≤ 25 °C; ceramic PCB, Al2O3, standard footprint 2
junction temperature Tj 150 °C 2
ambient temperature Tamb -55 150 °C 2
storage temperature Tstg -65 150 °C 2
thermal resistance from junction to ambient Rth(j-a) 200 K/W in free air; FR4 PCB, single-sided copper, tin-plated and standard footprint 3
thermal resistance from junction to ambient Rth(j-a) 120 K/W in free air; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 3
thermal resistance from junction to ambient Rth(j-a) 60 K/W in free air; ceramic PCB, Al2O3, standard footprint 3
thermal resistance from junction to solder point Rth(j-sp) 12 K/W soldering point of cathode tab 3
forward voltage VF 235 270 mV IF = 0.5 A; Tj = 25 °C 5
forward voltage VF 260 290 mV IF = 1 A; Tj = 25 °C 5
forward voltage VF 315 360 mV IF = 3 A; Tj = 25 °C 5
reverse current IR 1.5 5 mA VR = 30 V; Tj = 25 °C 5

CAD (KiCad official)

  • Symbol: PMEG3030EP
  • Footprint: Diode_SMD:D_SOD-128
  • 3D model: SOD-128 (KiCad packages3D, STEP)
  • 3D model files: pmeg3030ep-etched.step / pmeg3030ep-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg3030ep.step / pmeg3030ep.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 563b2506eb151434, retrieved 2026-10-15, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF