component
PMEG3030BEP-QX
Public Made by Adomby adom
Nexperia Schottky Diodes, SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownPMEG3030BEP-QX
Nexperia · Schottky Diodes · SOD-128
PMEG3030BEP-QX from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode terminal, identified by the marking bar on the package; the datasheet gives a reverse voltage VR of 30 V maximum at Tj = 25 °C for the device. |
| 2 | A | passive | Anode terminal of the Schottky barrier rectifier; the datasheet gives no pin-specific limit, so the device limiting values (for example VR ≤ 30 V and IF(AV) ≤ 3 A) apply. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse voltage | VR | 30 | V | Tj = 25 °C | 2 | ||
| Average forward current | IF(AV) | 3 | A | δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 70 °C; device on ceramic PCB, Al2O3, standard footprint | 2 | ||
| Non-repetitive peak forward current | IFSM | 50 | A | tp = 8.3 ms; half-sine wave; Tj(init) = 25 °C | 2 | ||
| Total power dissipation | Ptot | 625 | mW | Tamb ≤ 25 °C; footnote [2]: FR4 PCB, single-sided copper, tin-plated, standard footprint | 2 | ||
| Total power dissipation | Ptot | 1.05 | W | Tamb ≤ 25 °C; footnote [3]: FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² | 2 | ||
| Total power dissipation | Ptot | 2.1 | W | Tamb ≤ 25 °C; footnote [1]: ceramic PCB, Al2O3, standard footprint | 2 | ||
| Junction temperature | Tj | 150 | °C | 2 | |||
| Ambient temperature | Tamb | -55 | 150 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 2 | ||
| Thermal resistance from junction to ambient in free air | Rth(j-a) | 200 | K/W | FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 | ||
| Thermal resistance from junction to ambient in free air | Rth(j-a) | 120 | K/W | FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² | 3 | ||
| Thermal resistance from junction to ambient in free air | Rth(j-a) | 60 | K/W | Ceramic PCB, Al2O3, standard footprint | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 12 | K/W | Soldering point of cathode tab | 3 | ||
| Forward voltage | VF | 280 | 320 | mV | IF = 0.1 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 330 | 380 | mV | IF = 0.5 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 350 | 400 | mV | IF = 1 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 365 | 420 | mV | IF = 1.5 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 380 | 440 | mV | IF = 2 A; Tj = 25 °C | 4 | |
| Forward voltage | VF | 400 | 450 | mV | IF = 3 A; Tj = 25 °C | 4 | |
| Reverse current | IR | 55 | 150 | µA | VR = 30 V; Tj = 25 °C | 4 | |
| Reverse current | IR | 6 | µA | VR = 5 V; Tj = 25 °C | 4 | ||
| Reverse current | IR | 9 | mA | VR = 10 V; Tj = 25 °C | 4 | ||
| Diode capacitance | Cd | 500 | pF | VR = 1 V; f = 1 MHz; Tj = 25 °C | 4 | ||
| Diode capacitance | Cd | 170 | pF | VR = 10 V; f = 1 MHz; Tj = 25 °C | 4 |
CAD (KiCad official)
- Symbol:
PMEG3030BEP-QX - Footprint:
Diode_SMD:D_SOD-128 - 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files:
pmeg3030bep-qx-etched.step/pmeg3030bep-qx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pmeg3030bep-qx.step/pmeg3030bep-qx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (12 pp, sha256
414dd27bba6012ac, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).