component

PMEG3020EGWX

Public Made by Adom

by adom

Nexperia Schottky Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentdiodespmeg3020egwxfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
pmeg3020egwx / README.md
History Download
Ray Publish 0.1.0 7a933ae 9h ago

PMEG3020EGWX

Nexperia · Schottky Diodes · SOD-123

PMEG3020EGWX from Nexperia, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Schottky barrier rectifier.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse voltage VR 30 V Tj = 25 °C 2
Forward current IF 2 A Tsp ≤ 55 °C 2
Average forward current IF(AV) 2 A δ = 0.5; f = 20 kHz; square wave; Tsp ≤ 115 °C 2
Repetitive peak forward current IFRM 4.5 A tp ≤ 1 ms; δ ≤ 0.25 2
Non-repetitive peak forward current IFSM 9 A tp = 8 ms; square wave; Tj(init) = 25 °C 2
Total power dissipation Ptot 400 mW Tamb ≤ 25 °C; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint 2
Total power dissipation Ptot 660 mW [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 (no Tamb condition printed on this row) 2
Junction temperature Tj 150 °C 2
Ambient temperature Tamb -55 150 °C 2
Storage temperature Tstg -65 150 °C 2
Thermal resistance from junction to ambient in free air Rth(j-a) 310 K/W [2] FR4 PCB, single-sided copper, tin-plated, standard footprint 3
Thermal resistance from junction to ambient (mounting pad) Rth(j-a) 190 K/W [3] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 3
Thermal resistance from junction to solder point Rth(j-sp) 29 K/W [4] Soldering point of cathode tab 3
Reverse breakdown voltage V(BR)R 30 V IR = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 125 160 mV IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 185 220 mV IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 255 290 mV IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 330 380 mV IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 400 480 mV IF = 1 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Forward voltage VF 510 620 mV IF = 2 A; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C 4
Reverse current IR 60 150 µA VR = 10 V; pulsed; Tj = 25 °C; [1] very short test pulse 4
Reverse current IR 400 1000 µA VR = 30 V; pulsed; Tj = 25 °C; [1] very short test pulse 4
Diode capacitance Cd 60 72 pF VR = 1 V; f = 1 MHz; Tj = 25 °C 4

CAD (KiCad official)

  • Symbol: PMEG3020EGWX
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: pmeg3020egwx-etched.step / pmeg3020egwx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg3020egwx.step / pmeg3020egwx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (9 pp, sha256 9e24c4991cc65e72, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF