component
PMEG3010EGWX
Public Made by Adomby adom
Nexperia Schottky Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownPMEG3010EGWX
Nexperia · Schottky Diodes · SOD-123
PMEG3010EGWX from Nexperia, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode of the Schottky barrier diode; the marking bar on the package indicates the cathode. |
| 2 | A | passive | Anode of the Schottky barrier diode, the opposite terminal to the cathode (pin 1). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-123 |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse breakdown voltage | V(BR)R | 30 | V | IR = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | ||
| Forward voltage | 90 | 130 | mV | IF = 0.1 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | ||
| Forward voltage | 150 | 200 | mV | IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | ||
| Forward voltage | 215 | 250 | mV | IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | ||
| Forward voltage | 285 | 340 | mV | IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | ||
| Forward voltage | 380 | 430 | mV | IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02; Tj = 25 °C | 4 | ||
| Forward voltage | VF | 450 | 560 | mV | IF = 1 A; tp ≤ 300 µs; δ = 0.02; Tj = 25 °C | 4 | |
| Reverse current | IR | 12 | 30 | µA | VR = 10 V; pulsed; Tj = 25 °C | 4 | |
| Reverse current | IR | 40 | 150 | µA | VR = 30 V; pulsed; Tj = 25 °C | 4 | |
| Diode capacitance | Cd | 55 | 70 | pF | VR = 1 V; f = 1 MHz; Tj = 25 °C | 4 | |
| Reverse voltage | VR | 30 | V | Tj = 25 °C | 2 | ||
| Forward current | IF | 1 | A | Tsp ≤ 55 °C | 2 | ||
| Average forward current | IF(AV) | 1 | A | δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 70 °C | 2 | ||
| Repetitive peak forward current | IFRM | 7 | A | tp ≤ 1 ms; δ ≤ 0.25 | 2 | ||
| Non-repetitive peak forward current | IFSM | 9 | A | tp = 8 ms; square wave; Tj(init) = 25 °C | 2 | ||
| Total power dissipation | Ptot | 400 | mW | Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, standard footprint | 2 | ||
| Total power dissipation | Ptot | 660 | mW | FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² | 2 | ||
| Junction temperature | Tj | 150 | °C | 2 | |||
| Ambient temperature | Tamb | -55 | 150 | °C | 2 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 2 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 310 | K/W | In free air; FR4 PCB, single-sided copper, tin-plated, standard footprint | 3 | ||
| Thermal resistance from junction to ambient | Rth(j-a) | 190 | K/W | In free air; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm² | 3 | ||
| Thermal resistance from junction to solder point | Rth(j-sp) | 29 | K/W | Soldering point of cathode tab | 3 |
CAD (KiCad official)
- Symbol:
PMEG3010EGWX - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123 (KiCad packages3D, STEP)
- 3D model files:
pmeg3010egwx-etched.step/pmeg3010egwx-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);pmeg3010egwx.step/pmeg3010egwx.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Nexperia datasheet (9 pp, sha256
610ae269cf25cf6f, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).