component

PMEG3010BEP

Public Made by Adom

by adom

Nexperia Schottky Barrier Diodes (SBD), SOD-128. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentdiodespmeg3010bepfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
pmeg3010bep / README.md
History Download
Ray Publish 0.1.0 0e545aa 2d ago

PMEG3010BEP

Nexperia · Schottky Barrier Diodes (SBD) · SOD-128

PMEG3010BEP from Nexperia, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode; the marking bar indicates the cathode, and the cathode tab is the solder point for Rth(j-sp) (max 12 K/W).
2 A passive Anode of the Schottky barrier rectifier, rated for reverse voltage VR up to 30 V and average forward current IF(AV) up to 1 A.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-128
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse voltage VR 30 V Tj = 25 °C 2
Average forward current IF(AV) 1 A δ = 0.5; f = 20 kHz; square wave; Tamb ≤ 120 °C; ceramic PCB Al2O3, standard footprint 2
Non-repetitive peak forward current IFSM 50 A tp = 8.3 ms; half sine wave; Tj(init) = 25 °C 2
Total power dissipation (FR4, standard footprint) Ptot 625 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 2
Total power dissipation (FR4, 1 cm2 cathode pad) Ptot 1.05 W Tamb ≤ 25 °C; FR4 PCB, cathode pad 1 cm2 2
Total power dissipation (ceramic PCB) Ptot 2.1 W Tamb ≤ 25 °C; ceramic PCB Al2O3, standard footprint 2
Junction temperature Tj 150 °C 2
Ambient temperature Tamb -55 150 °C 2
Storage temperature Tstg -65 150 °C 2
Thermal resistance junction to ambient (FR4, standard footprint) Rth(j-a) 200 K/W in free air; FR4 PCB, standard footprint 3
Thermal resistance junction to ambient (FR4, 1 cm2 cathode pad) Rth(j-a) 120 K/W in free air; FR4 PCB, cathode pad 1 cm2 3
Thermal resistance junction to ambient (ceramic PCB) Rth(j-a) 60 K/W in free air; ceramic PCB Al2O3, standard footprint 3
Thermal resistance junction to solder point Rth(j-sp) 12 K/W Soldering point of cathode tab 3
Forward voltage VF 315 360 mV IF = 0.1 A; Tj = 25 °C 4
Forward voltage VF 390 430 mV IF = 0.7 A; Tj = 25 °C 4
Forward voltage VF 405 450 mV IF = 1 A; Tj = 25 °C 4
Reverse current IR 15 50 µA VR = 30 V; Tj = 25 °C 4
Reverse current IR 2 µA VR = 5 V; Tj = 25 °C 4
Reverse current IR 3 µA VR = 10 V; Tj = 25 °C 4
Diode capacitance Cd 170 pF VR = 1 V; f = 1 MHz; Tj = 25 °C 4
Diode capacitance Cd 60 pF VR = 10 V; f = 1 MHz; Tj = 25 °C 4

CAD (KiCad official)

  • Symbol: PMEG3010BEP
  • Footprint: Diode_SMD:D_SOD-128
  • 3D model: SOD-128 (KiCad packages3D, STEP)
  • 3D model files: pmeg3010bep-etched.step / pmeg3010bep-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg3010bep.step / pmeg3010bep.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 b26a1ee94a48c305, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF