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PMEG3005EJ

Nexperia · Schottky Barrier Diodes (SBD) · SOD-323F

PMEG3005EJ from Nexperia, in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky diode (marked by the marking bar); reverse voltage limit 30 V and forward current 0.5 A.
2 A passive Anode of the Schottky diode; forward voltage 380 mV typ (430 mV max) at IF = 500 mA.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage VF 90 130 mV IF = 0.1 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
Forward voltage VF 150 200 mV IF = 1 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
Forward voltage VF 215 250 mV IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
Forward voltage VF 285 340 mV IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
Forward voltage VF 380 430 mV IF = 500 mA; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
Reverse current IR 12 30 µA VR = 10 V; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
Reverse current IR 40 150 µA VR = 30 V; tp ≤ 300 µs; δ ≤ 0.02; pulsed; Tamb = 25 °C 3
Diode capacitance Cd 55 70 pF VR = 1 V; f = 1 MHz; Tamb = 25 °C 3
Reverse voltage VR 30 V Tamb = 25 °C 2
Forward current IF 0.5 A Tsp ≤ 55 °C 2
Repetitive peak forward current IFRM 7 A tp ≤ 1 ms; δ ≤ 0.25 2
Non-repetitive peak forward current IFSM 10 A tp = 8 ms; square wave; Tj(init) = 25 °C 2
Total power dissipation Ptot 360 mW Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, standard footprint 2
Total power dissipation Ptot 830 mW Tamb ≤ 25 °C; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 2
Junction temperature Tj 150 °C 2
Ambient temperature Tamb -65 150 °C 2
Storage temperature Tstg -65 150 °C 2
Thermal resistance junction to ambient Rth(j-a) 350 K/W in free air; FR4 PCB, single-sided copper, tin-plated, standard footprint 2
Thermal resistance junction to ambient Rth(j-a) 150 K/W in free air; FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 2
Thermal resistance junction to solder point Rth(j-sp) 55 K/W 2

CAD (KiCad official)

  • Symbol: PMEG3005EJ
  • Footprint: Diode_SMD:D_SOD-323F
  • 3D model: SOD-323F (KiCad packages3D, STEP)
  • 3D model files: pmeg3005ej-etched.step / pmeg3005ej-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg3005ej.step / pmeg3005ej.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (8 pp, sha256 e3029e896d581087, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF