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Contents

Pinout
Key specifications
Electrical characteristics
CAD (KiCad official)
Provenance

README

markdown

PMEG2010AEH

Nexperia · Schottky Barrier Diodes (SBD) · SOD-123F

PMEG2010AEH from Nexperia, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	K	passive	Cathode of the Schottky barrier diode; the cathode tab is the soldering point referenced for the junction-to-solder-point thermal resistance, and the reverse voltage limit is 20 V maximum.
2	A	passive	Anode of the Schottky barrier diode; device limits apply, including 20 V maximum reverse voltage and 1 A maximum forward current at Tsp ≤ 55 °C.

Key specifications

Parameter	Value
Manufacturer	Nexperia
Package	SOD-123F
Category	Diodes
Pins	2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Reverse voltage	VR			20	V		2
Forward current	IF			1	A	Tsp ≤ 55 °C	2
Repetitive peak forward current	IFRM			7	A	tp ≤ 1 ms; δ ≤ 0.25	2
Non-repetitive peak forward current	IFSM			9	A	tp = 8 µs; square wave	2
Total power dissipation	Ptot			375	mW	Tamb ≤ 25 °C; [1] FR4 PCB, single-sided copper, standard footprint	2
Total power dissipation	Ptot			830	mW	[2] FR4 PCB, single-sided copper, mounting pad for cathode 1 cm2	2
Junction temperature	Tj			150	°C		2
Ambient temperature	Tamb	-65		150	°C		2
Storage temperature	Tstg	-65		150	°C		2
Thermal resistance from junction to ambient in free air	Rth(j-a)			330	K/W	[1] thermal-runaway note; [2] FR4 PCB, single-sided copper, standard footprint	2
Thermal resistance from junction to ambient in free air	Rth(j-a)			150	K/W	[1] thermal-runaway note; [3] FR4 PCB, single-sided copper, mounting pad for cathode 1 cm2	2
Thermal resistance from junction to solder point	Rth(j-sp)			60	K/W	[4] soldering point of cathode tab	2
Forward voltage	VF		200	220	mV	IF = 10 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C	3
Forward voltage	VF		265	290	mV	IF = 100 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C	3
Forward voltage	VF		380	430	mV	IF = 1 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C	3
Reverse current	IR		15	50	µA	VR = 5 V; Tamb = 25 °C	3
Reverse current	IR		20	80	µA	VR = 10 V; Tamb = 25 °C	3
Reverse current	IR		50	200	µA	VR = 20 V; Tamb = 25 °C	3
Diode capacitance	Cd		55	70	pF	VR = 5 V; f = 1 MHz; Tamb = 25 °C	3

CAD (KiCad official)

Symbol: PMEG2010AEH
Footprint: Diode_SMD:D_SOD-123F
3D model: SOD-123F (KiCad packages3D, STEP)
3D model files: pmeg2010aeh-etched.step / pmeg2010aeh-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg2010aeh.step / pmeg2010aeh.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Nexperia datasheet (8 pp, sha256 ca0b6e215358c92e, retrieved 2026-10-21, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF