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Contents

README

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PMEG1030EJ

Nexperia · Schottky Barrier Diodes (SBD) · SOD-323F

PMEG1030EJ from Nexperia, in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Schottky barrier rectifier (marking bar side); rated for 10 V reverse voltage and 3 A forward current.
2 A passive Anode of the Schottky barrier rectifier; forward current up to 3 A (Tsp ≤ 55 °C) with typical VF of 390 mV at 3 A.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
forward voltage VF 100 130 mV IF = 10 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C 3
forward voltage VF 170 200 mV IF = 100 mA; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C 3
forward voltage VF 280 350 mV IF = 1 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C 3
forward voltage VF 390 530 mV IF = 3 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02; Tamb = 25 °C 3
reverse current IR 0.55 2 mA VR = 5 V; Tamb = 25 °C 3
reverse current IR 0.8 2.5 mA VR = 8 V; Tamb = 25 °C 3
reverse current IR 1 3 mA VR = 10 V; Tamb = 25 °C 3
diode capacitance Cd 70 85 pF VR = 1 V; f = 1 MHz; Tamb = 25 °C 3
reverse voltage VR 10 V 2
forward current IF 3 A Tsp ≤ 55 °C 2
repetitive peak forward current IFRM 5.5 A tp ≤ 1 ms; δ ≤ 0.25 2
non-repetitive peak forward current IFSM 9 A tp = 8 ms; square wave; Tj(init) = 25 °C 2
total power dissipation Ptot 360 mW Tamb ≤ 25 °C; FR4 PCB, standard footprint 2
total power dissipation Ptot 830 mW Tamb ≤ 25 °C; FR4 PCB, mounting pad for cathode 1 cm2 2
junction temperature Tj 150 °C 2
ambient temperature Tamb -65 150 °C 2
storage temperature Tstg -65 150 °C 2
thermal resistance from junction to ambient Rth(j-a) 350 K/W in free air; FR4 PCB, standard footprint 2
thermal resistance from junction to ambient Rth(j-a) 150 K/W in free air; FR4 PCB, mounting pad for cathode 1 cm2 2
thermal resistance from junction to solder point Rth(j-sp) 55 K/W 2

CAD (KiCad official)

  • Symbol: PMEG1030EJ
  • Footprint: Diode_SMD:D_SOD-323F
  • 3D model: SOD-323F (KiCad packages3D, STEP)
  • 3D model files: pmeg1030ej-etched.step / pmeg1030ej-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg1030ej.step / pmeg1030ej.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (8 pp, sha256 77f40aded0dde197, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF