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PMEG040V050EPE-QZ

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by adom

Nexperia Schottky Diodes, TO-277. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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PMEG040V050EPE-QZ

Nexperia · Schottky Diodes · TO-277

PMEG040V050EPE-QZ from Nexperia, in a TO-277. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the Schottky diode; pins 1 and 2 are both anodes and should be tied together as printed in Table 2.
2 A passive Anode of the Schottky diode; pin 2 is one of the two anode pins listed in Table 2 alongside pin 1.
3 K passive Cathode of the Schottky diode; the datasheet's thermal data refers to the soldering point of this cathode tab, and the cathode mounting pad is specified at 1 cm² for the 2nd thermal case.

Key specifications

Parameter Value
Manufacturer Nexperia
Package TO-277
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse voltage VR 40 V Tj = 25 °C 2
Forward current IF 7 A δ = 1; Tsp ≤ 171 °C 2
Average forward current IF(AV) 5 A δ = 0.5; f = 20 kHz; square wave; Tsp ≤ 172 °C 2
Non-repetitive peak forward current IFSM 120 A half sine-wave pulse; tp = 8.3 ms; Tj(init) = 25 °C 2
Total power dissipation Ptot 1.66 W Tamb ≤ 25 °C; [1] FR4 PCB, single-sided copper, tin-plated, standard footprint 2
Total power dissipation Ptot 2.15 W [2] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 2
Junction temperature Tj 175 °C 2
Ambient temperature Tamb -55 175 °C 2
Storage temperature Tstg -65 175 °C 2
Thermal resistance from junction to ambient in free air Rth(j-a) 90 K/W in free air; [1][2] FR4 PCB, single-sided copper, tin-plated, standard footprint 3
Thermal resistance from junction to ambient in free air Rth(j-a) 70 K/W in free air; [1][3] FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2 3
Thermal resistance from junction to solder point Rth(j-sp) 3 K/W [4] soldering point of cathode tab 3
Reverse breakdown voltage V(BR)R 40 V IR = 3 mA; pulsed; Tj = 25 °C [1] 4
Forward voltage VF 360 420 mV IF = 1 A; pulsed; Tj = 25 °C [1] 4
Forward voltage VF 425 490 mV IF = 3 A; pulsed; Tj = 25 °C [1] 4
Forward voltage VF 475 520 mV IF = 5 A; pulsed; Tj = 25 °C [1] 4
Forward voltage VF 515 590 mV IF = 5 A; pulsed; Tj = -40 °C [1] 4
Forward voltage VF 415 480 mV IF = 5 A; pulsed; Tj = 125 °C [1] 4
Reverse current IR 30 120 µA VR = 40 V; pulsed; Tj = 25 °C [1] 4

CAD (KiCad official)

  • Symbol: PMEG040V050EPE-QZ
  • Footprint: Package_TO_SOT_SMD:TO-277A
  • 3D model: TO-277 (KiCad packages3D, STEP)
  • 3D model files: pmeg040v050epe-qz-etched.step / pmeg040v050epe-qz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pmeg040v050epe-qz.step / pmeg040v050epe-qz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 9fb63fb3e0bea582, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF