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Contents

README

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PJ54BM33SE

PJSEMI · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5

PJ54BM33SE from PJSEMI, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN/EN power_in Power input voltage (VIN) for the LDO; the pin is printed as VIN/EN in the pin-out drawing, and the functional table lists VIN as the power input, with the absolute maximum VIN to GND rated -0.3 to +55 V and the electrical input voltage range 3 to 45 V.
2 GND power_in Ground reference for the regulator; the input and output capacitors must be returned to this pin as close as possible to the device.
3 EN/VIN input Chip enable, active high; the datasheet notes this pin is high impedance, and absolute maximum EN to GND voltage is -0.3 to +55 V. The drawing labels this pin EN/VIN, so the EN/VIN assignment of pins 1 and 3 should be confirmed.
4 NC unconnected No internal connection.
5 VOUT power_out Regulated output voltage; absolute maximum VOUT to GND is -0.3 to +6 V and the output capacitor (minimum 10 µF ceramic, X7R or X5R) must be placed close to this pin and GND.

Key specifications

Parameter Value
Manufacturer PJSEMI
Package SOT-23-5
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage VIN 3 45 V 5
Output Voltage Accuracy ΔVOUT -2 2 % VIN=12V, IOUT=10mA 5
Maximum Output Current IOUT_Max 300 350 mA 5
Current Limit (row printed as 'Current Limit VIH') VIH 1 V 5
VIN to GND Voltage VIN -0.3 55 V 4
VOUT to GND Voltage VOUT -0.3 6 V 4
VOUT to VIN Voltage VOUT-VIN -55 0.3 V 4
EN to GND Voltage EN -0.3 55 V 4
Power Dissipation 400 mW 4
Thermal Resistance, Junction-to-Ambient 300 °C/W 4
Operating Ambient Temperature TA -40 85 °C 4
Junction Temperature TJ 150 °C 4
Storage Temperature Range TSTG -40 150 °C 4
ESD (HBM) 4 KV HBM 4
Recommended minimum output capacitance COUT 10 µF ceramic; X7R or X5R temperature characteristic recommended 8

CAD (KiCad official)

  • Symbol: PJ54BM33SE
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5 (KiCad packages3D, STEP)
  • 3D model files: pj54bm33se-etched.step / pj54bm33se-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); pj54bm33se.step / pj54bm33se.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: PJSEMI datasheet (9 pp, sha256 9d606d10633cada4, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF